Pirani pressure sensor for smart wafer-level packaging

Systems in Package (SiP) contain an increasing number of MEMS components such as resonators for time references or RF filtering. These resonators are packaged at wafer level and the cavity quality has to be guaranteed in terms of pressure and moisture level by the final manufacturing test. Therefore...

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Bibliographische Detailangaben

Veröffentlicht in:	Sensors and actuators. A. Physical. 2009-11, Vol.156 (1), p.201-207
Hauptverfasser:	Mailly, F., Dumas, N., Pous, N., Latorre, L., Garel, O., Martincic, E., Verjus, F., Pellet, C., Dufour-Gergam, E., Nouet, P.
Format:	Artikel
Sprache:	eng
Schlagworte:	Cavity resonators Design engineering Engineering Sciences Mathematical models Matlab MEMS Micro and nanotechnologies Microelectronics Packaging Pressure sensor Pressure sensors Resonators Sensors Smart packaging Thermal sensor
Online-Zugang:	Volltext
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