Electrolytic Micro‐Capacitors Based on Tantalum Films for High Voltage Applications

Electrolytic capacitors are known to be fast devices with very low time constant and able to deliver high power. This class of capacitors is then an interesting technology to power miniaturized embedded electronics for Internet of Things applications. However, the current electrolytic capacitor suffers from its bulky size that does not fit with the miniaturization. To solve this issue, a proof‐of‐concept consisting of miniaturizing an electrolytic capacitor based on tantalum materials to give rise to a new class of electrolytic micro‐capacitors is proposed. To reach this ambitious objective, thin films (20 Volts) in aqueous electrolyte are produced. The Ta/Ta2O5 and TaN/Ta2O5 interfaces when the electrode is polarized near and beyond the breakdown voltage of the dielectric layer are carefully investigated. Polarizing the electrodes beyond the breakdown voltage are shown to result in anodization‐like mechanisms. In the case of the TaN/Ta2O5 electrode, an N‐rich porous layer grew within the Ta2O5 layer as polarization increased. A comparative study on the 2 stacked layers electrodes with different compositions (Ta/Ta2O5 and TaN/Ta2O5) but similar thicknesses (45/25 nm) is carried out: both electrodes show excellent capacitance retention of over 90% over 300 000 cycles. The frequency behavior of Ta/Ta2O5 and TaN/Ta2O5 electrodes shows that both are potential candidates in electrolytic micro‐capacitors for powering miniaturized electronics. A comparative study of 2 stacked layers with different compositions (Ta/Ta2O5 and TaN/Ta2O5) but similar thicknesses (45/25 nm) acting as an electrode of electrolytic micro‐capacitor is carried out in 0.5 M H2SO4 aqueous electrolyte. The interfaces of the sputtered films are carefully investigated when the cell voltage is higher than the breakdown voltage of the dielectric Ta2O5 layer.