Effect of ohmic heating on the structure and properties of flexible multilayer packaging
Food-packaging-processing interactions define packaging materials' performance properties and product quality. This study evaluated the effect of ohmic heating (OH) processing and different food simulants on the properties of four multilayer flexible packaging materials (PETmet/PE, PETmet/PP, P...
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Veröffentlicht in: | Food chemistry 2024-10, Vol.456, p.140038, Article 140038 |
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creator | Marangoni Júnior, Luís Rodrigues, Rui M. Pereira, Ricardo N. Augusto, Pedro Esteves Duarte Ito, Danielle Teixeira, Fábio Gomes Padula, Marisa Vicente, António A. |
description | Food-packaging-processing interactions define packaging materials' performance properties and product quality. This study evaluated the effect of ohmic heating (OH) processing and different food simulants on the properties of four multilayer flexible packaging materials (PETmet/PE, PETmet/PP, PET/Al/PE, and PET/Al/PA/PP). OH treatment was applied to the sealed packages containing the food simulants using a voltage gradient of 3.7 V/cm at a frequency of 20 kHz, resulting in a thermal process of at 80 °C for 1 min. The structure and performance of the different packages were then evaluated. The materials did not show changes in chemical groups nor thermal properties. However, the simulant-packaging-processing interaction resulted in changes in crystallinity, morphology, mechanical and barrier properties (water and oxygen), especially for metallized films in contact with acidic food simulants. The results indicate that although OH resulted in changes in packaging materials, these materials can be used under the conditions applied in this study.
•Ohmic heating changed the crystallinity and morphology of multilayer packaging.•Ohmic heating enhanced water vapor and oxygen transmission in metallized films•Few changes in mechanical properties were induced by ohmic heating.•Chemical structure and thermal stability remained unchanged |
doi_str_mv | 10.1016/j.foodchem.2024.140038 |
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•Ohmic heating changed the crystallinity and morphology of multilayer packaging.•Ohmic heating enhanced water vapor and oxygen transmission in metallized films•Few changes in mechanical properties were induced by ohmic heating.•Chemical structure and thermal stability remained unchanged</description><subject>Barrier properties</subject><subject>Chemical and Process Engineering</subject><subject>Emerging technology</subject><subject>Engineering Sciences</subject><subject>Food and Nutrition</subject><subject>Food packaging</subject><subject>Food thermal process</subject><subject>Heat sealing strength</subject><subject>Life Sciences</subject><subject>Tensile strength</subject><issn>0308-8146</issn><issn>1873-7072</issn><issn>1873-7072</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2024</creationdate><recordtype>article</recordtype><recordid>eNqFkcFu1DAQhi0EokvhFSof4ZBlHCe2c6OqCq20EheQuFkTZ9x4SdaLnVTt25NV2l57smx9_z_yfIxdCNgKEOrrfutj7FxP47aEstqKCkCaN2wjjJaFBl2-ZRuQYAojKnXGPuS8B4AShHnPzqQxWoFqNuzPtffkJh49j_0YHO8Jp3C44_HAp554ntLspjkRx0PHjykeKU2B8ingB3oI7UB8nIcpDPhIiR_R_cW7peAje-dxyPTp6Txnv79f_7q6KXY_f9xeXe4KJ3U1FY2WWsgOoVYteiwdIHQayWvssCyhFmXjpVouom0abzoNSpaVR4m1butWnrMva2-Pgz2mMGJ6tBGDvbnc2dMbVEqAVOJeLOznlV3-8W-mPNkxZEfDgAeKc7YSlNF1XUuzoGpFXYo5J_Iv3QLsyYDd22cD9mTArgaW4MXTjLkdqXuJPa98Ab6tAC1buQ-UbHaBDo66kBYTtovhtRn_AcM_mps</recordid><startdate>20241030</startdate><enddate>20241030</enddate><creator>Marangoni Júnior, Luís</creator><creator>Rodrigues, Rui M.</creator><creator>Pereira, Ricardo N.</creator><creator>Augusto, Pedro Esteves Duarte</creator><creator>Ito, Danielle</creator><creator>Teixeira, Fábio Gomes</creator><creator>Padula, Marisa</creator><creator>Vicente, António A.</creator><general>Elsevier Ltd</general><general>Elsevier</general><scope>NPM</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7X8</scope><scope>1XC</scope><scope>VOOES</scope></search><sort><creationdate>20241030</creationdate><title>Effect of ohmic heating on the structure and properties of flexible multilayer packaging</title><author>Marangoni Júnior, Luís ; Rodrigues, Rui M. ; Pereira, Ricardo N. ; Augusto, Pedro Esteves Duarte ; Ito, Danielle ; Teixeira, Fábio Gomes ; Padula, Marisa ; Vicente, António A.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c374t-973713da056bafa2c0a0d7aef7ada2205129f36ada1b99f8d706324fa3a57b5b3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2024</creationdate><topic>Barrier properties</topic><topic>Chemical and Process Engineering</topic><topic>Emerging technology</topic><topic>Engineering Sciences</topic><topic>Food and Nutrition</topic><topic>Food packaging</topic><topic>Food thermal process</topic><topic>Heat sealing strength</topic><topic>Life Sciences</topic><topic>Tensile strength</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Marangoni Júnior, Luís</creatorcontrib><creatorcontrib>Rodrigues, Rui M.</creatorcontrib><creatorcontrib>Pereira, Ricardo N.</creatorcontrib><creatorcontrib>Augusto, Pedro Esteves Duarte</creatorcontrib><creatorcontrib>Ito, Danielle</creatorcontrib><creatorcontrib>Teixeira, Fábio Gomes</creatorcontrib><creatorcontrib>Padula, Marisa</creatorcontrib><creatorcontrib>Vicente, António A.</creatorcontrib><collection>PubMed</collection><collection>CrossRef</collection><collection>MEDLINE - Academic</collection><collection>Hyper Article en Ligne (HAL)</collection><collection>Hyper Article en Ligne (HAL) (Open Access)</collection><jtitle>Food chemistry</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Marangoni Júnior, Luís</au><au>Rodrigues, Rui M.</au><au>Pereira, Ricardo N.</au><au>Augusto, Pedro Esteves Duarte</au><au>Ito, Danielle</au><au>Teixeira, Fábio Gomes</au><au>Padula, Marisa</au><au>Vicente, António A.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Effect of ohmic heating on the structure and properties of flexible multilayer packaging</atitle><jtitle>Food chemistry</jtitle><addtitle>Food Chem</addtitle><date>2024-10-30</date><risdate>2024</risdate><volume>456</volume><spage>140038</spage><pages>140038-</pages><artnum>140038</artnum><issn>0308-8146</issn><issn>1873-7072</issn><eissn>1873-7072</eissn><abstract>Food-packaging-processing interactions define packaging materials' performance properties and product quality. This study evaluated the effect of ohmic heating (OH) processing and different food simulants on the properties of four multilayer flexible packaging materials (PETmet/PE, PETmet/PP, PET/Al/PE, and PET/Al/PA/PP). OH treatment was applied to the sealed packages containing the food simulants using a voltage gradient of 3.7 V/cm at a frequency of 20 kHz, resulting in a thermal process of at 80 °C for 1 min. The structure and performance of the different packages were then evaluated. The materials did not show changes in chemical groups nor thermal properties. However, the simulant-packaging-processing interaction resulted in changes in crystallinity, morphology, mechanical and barrier properties (water and oxygen), especially for metallized films in contact with acidic food simulants. The results indicate that although OH resulted in changes in packaging materials, these materials can be used under the conditions applied in this study.
•Ohmic heating changed the crystallinity and morphology of multilayer packaging.•Ohmic heating enhanced water vapor and oxygen transmission in metallized films•Few changes in mechanical properties were induced by ohmic heating.•Chemical structure and thermal stability remained unchanged</abstract><cop>England</cop><pub>Elsevier Ltd</pub><pmid>38876069</pmid><doi>10.1016/j.foodchem.2024.140038</doi><oa>free_for_read</oa></addata></record> |
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subjects | Barrier properties Chemical and Process Engineering Emerging technology Engineering Sciences Food and Nutrition Food packaging Food thermal process Heat sealing strength Life Sciences Tensile strength |
title | Effect of ohmic heating on the structure and properties of flexible multilayer packaging |
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