Transient thermal behaviour of a substrate subjected to the activation of an electronic chip and surface cooling

Controlling the temperature of electronic components is a major interest for the electronics industry. Indeed, the lifetime of the components is directly dependent on the temperature levels reached in the electronic boards. Then, it is essential to predict the chip temperature evolution in order to...

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Veröffentlicht in:	Journal of Engineering & Processing Management 2023-08, Vol.15 (1), p.18-23
Hauptverfasser:	Bauzin, Jean-Gabriel, Cherikh, Mehdi Belkacem, Hocine, Ali, Laraqi, Najib, Nguyen, Minh-Nhat
Format:	Artikel
Sprache:	eng
Schlagworte:	Engineering Sciences Mechanics Thermics
Online-Zugang:	Volltext
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