Kinetics of copper electrodeposition in the presence of triethyl-benzyl ammonium chloride
Quasi-steady state hydrodynamic voltammetry at a rotating-disc electrode and electrochemical impedance spectroscopy were used to investigate the influence of triethyl-benzyl-ammonium (TEBA) chloride on the kinetics of copper electrodeposition from sulphate acidic electrolytes. SEM and X-ray diffract...
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| Veröffentlicht in: | Journal of applied electrochemistry 2003-08, Vol.33 (8), p.685-692 |
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| container_title | Journal of applied electrochemistry |
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| creator | VARVARA, S MURESAN, L POPESCU, I. C MAURIN, G |
| description | Quasi-steady state hydrodynamic voltammetry at a rotating-disc electrode and electrochemical impedance spectroscopy were used to investigate the influence of triethyl-benzyl-ammonium (TEBA) chloride on the kinetics of copper electrodeposition from sulphate acidic electrolytes. SEM and X-ray diffraction analysis were used to examine the morphology and the structure of copper deposits. The kinetic parameters (i0, *ac, k0), obtained by both Tafel and Koutecky-Levich interpretations lead to the conclusion that TEBA acts as an inhibitor of copper electrodeposition process, as a consequence of its adsorption on the electrode surface. The influence of TEBA on the kinetics of copper electrodeposition was explained in terms of a reaction model confirmed by the simulated impedance spectra. TEBA acts only as a blocking agent competing for adsorption active sites of the cathodic surface with cuprous ions without changing the reaction pathway corresponding to the absence of the additive. |
| doi_str_mv | 10.1023/A:1025069004355 |
| format | Article |
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TEBA acts only as a blocking agent competing for adsorption active sites of the cathodic surface with cuprous ions without changing the reaction pathway corresponding to the absence of the additive.</description><identifier>ISSN: 0021-891X</identifier><identifier>EISSN: 1572-8838</identifier><identifier>DOI: 10.1023/A:1025069004355</identifier><identifier>CODEN: JAELBJ</identifier><language>eng</language><publisher>Heidelberg: Springer</publisher><subject>Applied sciences ; Chemical Sciences ; Chemistry ; Electrochemistry ; Electrodeposition ; Exact sciences and technology ; General and physical chemistry ; Metallic coatings ; Metals. 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The influence of TEBA on the kinetics of copper electrodeposition was explained in terms of a reaction model confirmed by the simulated impedance spectra. TEBA acts only as a blocking agent competing for adsorption active sites of the cathodic surface with cuprous ions without changing the reaction pathway corresponding to the absence of the additive.</description><subject>Applied sciences</subject><subject>Chemical Sciences</subject><subject>Chemistry</subject><subject>Electrochemistry</subject><subject>Electrodeposition</subject><subject>Exact sciences and technology</subject><subject>General and physical chemistry</subject><subject>Metallic coatings</subject><subject>Metals. 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Metallurgy</topic><topic>Production techniques</topic><topic>Study of interfaces</topic><topic>Surface treatment</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>VARVARA, S</creatorcontrib><creatorcontrib>MURESAN, L</creatorcontrib><creatorcontrib>POPESCU, I. C</creatorcontrib><creatorcontrib>MAURIN, G</creatorcontrib><collection>Pascal-Francis</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Copper Technical Reference Library</collection><collection>Materials Research Database</collection><collection>Hyper Article en Ligne (HAL)</collection><jtitle>Journal of applied electrochemistry</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>VARVARA, S</au><au>MURESAN, L</au><au>POPESCU, I. 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The kinetic parameters (i0, *ac, k0), obtained by both Tafel and Koutecky-Levich interpretations lead to the conclusion that TEBA acts as an inhibitor of copper electrodeposition process, as a consequence of its adsorption on the electrode surface. The influence of TEBA on the kinetics of copper electrodeposition was explained in terms of a reaction model confirmed by the simulated impedance spectra. TEBA acts only as a blocking agent competing for adsorption active sites of the cathodic surface with cuprous ions without changing the reaction pathway corresponding to the absence of the additive.</abstract><cop>Heidelberg</cop><pub>Springer</pub><doi>10.1023/A:1025069004355</doi><tpages>8</tpages></addata></record> |
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| subjects | Applied sciences Chemical Sciences Chemistry Electrochemistry Electrodeposition Exact sciences and technology General and physical chemistry Metallic coatings Metals. Metallurgy Production techniques Study of interfaces Surface treatment |
| title | Kinetics of copper electrodeposition in the presence of triethyl-benzyl ammonium chloride |
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