$Methodology for DIC-based evaluation of the fracture behaviour of solder materials under monotonic and creep loadings$

Methodology for DIC-based evaluation of the fracture behaviour of solder materials under monotonic and creep loadings

•DIC-based evaluation of fracture parameters of lead-free solder.•Identification of appropriate constitutive laws for monotonic and creep behaviours.•Fitting procedure using measured displacement field for evaluation of SIF.•Domain integrals based on DIC data points used for evaluations of J and C(t...

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Veröffentlicht in:	Engineering fracture mechanics 2020-11, Vol.239, p.107285, Article 107285
Hauptverfasser:	Benabou, L., Nguyen-Van, T.A., Tao, Q.B., Le, V.N., Ould Ouali, M., Nguyen-Xuan, H.
Format:	Artikel
Sprache:	eng
Schlagworte:	Algorithms Creep (materials) DIC measurements Digital imaging Domain integrals Electronic packaging Engineering Sciences Evaluation Finite element method High temperature Lead free Materials Parameter identification Parameter uncertainty Rupture Solders Stress intensity factors Viscoplasticity
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