Influence of intermetallic compounds on the electrical resistivity of architectured copper clad aluminum composites elaborated by a restacking drawing method

Architectured wires containing 61 restacked Copper Clad Aluminum (CCA) wires were cold-drawn down to a diameter of 1mm without intermediate annealing. Samples were taken at intermediate diameters of 3mm and 1.7mm to observe the wire structure at different steps. Independently of the wire diameter, t...

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Veröffentlicht in:	Materials & Design 2018-10, Vol.155, p.366-374
Hauptverfasser:	Moisy, F., Gueydan, A., Sauvage, X., Guillet, A., Keller, C., Guilmeau, E., Hug, E.
Format:	Artikel
Sprache:	eng
Schlagworte:	Architectured wire Bimetallic composite Condensed Matter Electrical resistivity Intermetallic compound Materials Science Physics
Online-Zugang:	Volltext
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