Mechanical Reliability of Flexible Encapsulated Organic Solar Cells: Characterization and Improvement

The encapsulation of organic photovoltaic (OPV) devices can help mitigate the degradation induced by environmental factors like water and oxygen and thus potential to increase OPV lifetime. Because flexibility is an important parameter for targeted OPV applications, this paper proposes a fundamental...

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Veröffentlicht in:ACS applied materials & interfaces 2018-09, Vol.10 (35), p.29805-29813
Hauptverfasser: Juillard, Sacha, Planes, Emilie, Matheron, Muriel, Perrin, Lara, Berson, Solenn, Flandin, Lionel
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Sprache:eng
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Zusammenfassung:The encapsulation of organic photovoltaic (OPV) devices can help mitigate the degradation induced by environmental factors like water and oxygen and thus potential to increase OPV lifetime. Because flexibility is an important parameter for targeted OPV applications, this paper proposes a fundamental study on the impact of the roll-to-roll flexible encapsulation process. Both performance and mechanical reliability of encapsulated devices have been scouted. Furthermore, it has been demonstrated that a relatively simple peeling technique allows understanding the role of the interfaces inside a multilayered OPV device supported by a flexible poly­(ethylene terephthalate) substrate. For this purpose, the peeling strengths between each layer were measured using a series of partial devices. This provided a quantitative analysis of the mechanical strength or quality of each interface. Two interfaces revealed pronounced weaknesses: active layer with hole transporting layer and transparent conducting electrode with electron transporting layer. Among various surface treatments applied to improve these interfaces, an optimized UV-ozone (UVO3) treatment proved to modify substantially the surface properties of used zinc oxide (ZnO) and thus improved its adhesion to the neighboring layers. The physicochemical and structural changes of ZnO have been confirmed by IR spectroscopy and contact angle measurements. It has also been shown that better interfaces within the device improve the overall performance of the devices and their resilience to roll-to-roll encapsulation.
ISSN:1944-8244
1944-8252
DOI:10.1021/acsami.8b06684