Analysis of an ESD failure mechanism on a SiC MESFET
Efficient energy management become more and more crucial with increasing energy resource scarcity. Power electronic will play a major role in this field and thus require innovations like using wide band gap semiconductor to build power devices. SiC, GaN, diamond material-based devices are currently...
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Veröffentlicht in: | Microelectronics and reliability 2014-09, Vol.54 (9-10), p.2217-2221 |
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container_title | Microelectronics and reliability |
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creator | Phulpin, T. Trémouilles, D. Isoird, K. Tournier, D. Godignon, P. Austin, P. |
description | Efficient energy management become more and more crucial with increasing energy resource scarcity. Power electronic will play a major role in this field and thus require innovations like using wide band gap semiconductor to build power devices. SiC, GaN, diamond material-based devices are currently more or less mature and will sooner or later require investigations on their reliability to allow their wide adoption. In this work we investigate on the robustness of a SiC-MESFET to ElectroStatic-Discharge (ESD). Surprisingly the ESD robustness is rather low and found to be related to both current non-uniformity and a quite unexpected parasitic NPN bipolar transistor triggering. The outcome of this study allows proposing first guidelines to optimize ESD robustness of such devices. |
doi_str_mv | 10.1016/j.microrel.2014.07.134 |
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fullrecord | <record><control><sourceid>hal_cross</sourceid><recordid>TN_cdi_hal_primary_oai_HAL_hal_01059962v1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><els_id>S0026271414003369</els_id><sourcerecordid>oai_HAL_hal_01059962v1</sourcerecordid><originalsourceid>FETCH-LOGICAL-c564t-4d40d9a6f209b68a402cfa4c06014270f229dd907ece2dfea7b92896438df7cb3</originalsourceid><addsrcrecordid>eNqFkE9LAzEQxYMoWKtfQXLx4GHXSZomm5ulVitUPFTBW0jzh6Zsd0tSC_32Zlnt1dPA472ZNz-EbgmUBAh_2JTbYGIbXV1SIKwEUZIRO0MDUglaSEa-ztEAgPKCCsIu0VVKGwAQQMgAsUmj62MKCbce6wbPlk_Y61B_R4e3zqx1E9IWtw3WeBmm-G22fJ59XKMLr-vkbn7nEH1mdTovFu8vr9PJojBjzvYFswys1NxTkCteaQbUeM0M8FyTCvCUSmslCGcctd5psZK0kpyNKuuFWY2G6L7fu9a12sWw1fGoWh3UfLJQnQYExlJyeiDZy3tvRpFSdP4UIKA6Tmqj_jipjpMCoTKnHLzrgzudjK591I0J6ZTuChFgkH2Pvc_ljw_BRZVMcI1xNkRn9sq24b9TP4KTfp8</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype></control><display><type>article</type><title>Analysis of an ESD failure mechanism on a SiC MESFET</title><source>Elsevier ScienceDirect Journals</source><creator>Phulpin, T. ; Trémouilles, D. ; Isoird, K. ; Tournier, D. ; Godignon, P. ; Austin, P.</creator><creatorcontrib>Phulpin, T. ; Trémouilles, D. ; Isoird, K. ; Tournier, D. ; Godignon, P. ; Austin, P.</creatorcontrib><description>Efficient energy management become more and more crucial with increasing energy resource scarcity. Power electronic will play a major role in this field and thus require innovations like using wide band gap semiconductor to build power devices. SiC, GaN, diamond material-based devices are currently more or less mature and will sooner or later require investigations on their reliability to allow their wide adoption. In this work we investigate on the robustness of a SiC-MESFET to ElectroStatic-Discharge (ESD). Surprisingly the ESD robustness is rather low and found to be related to both current non-uniformity and a quite unexpected parasitic NPN bipolar transistor triggering. The outcome of this study allows proposing first guidelines to optimize ESD robustness of such devices.</description><identifier>ISSN: 0026-2714</identifier><identifier>EISSN: 1872-941X</identifier><identifier>DOI: 10.1016/j.microrel.2014.07.134</identifier><identifier>CODEN: MCRLAS</identifier><language>eng</language><publisher>Kidlington: Elsevier Ltd</publisher><subject>Applied sciences ; Electrical engineering. Electrical power engineering ; Electronic equipment and fabrication. Passive components, printed wiring boards, connectics ; Electronics ; Engineering Sciences ; ESD ; Exact sciences and technology ; HBM robustness ; Parasitic transistor ; Power electronics, power supplies ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices ; SiC MESFET ; TCAD simulation ; TLP stress ; Transistors</subject><ispartof>Microelectronics and reliability, 2014-09, Vol.54 (9-10), p.2217-2221</ispartof><rights>2014 Elsevier Ltd</rights><rights>2015 INIST-CNRS</rights><rights>Distributed under a Creative Commons Attribution 4.0 International License</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c564t-4d40d9a6f209b68a402cfa4c06014270f229dd907ece2dfea7b92896438df7cb3</citedby><cites>FETCH-LOGICAL-c564t-4d40d9a6f209b68a402cfa4c06014270f229dd907ece2dfea7b92896438df7cb3</cites><orcidid>0000-0002-2878-6952 ; 0000-0001-8446-9129 ; 0000-0001-7473-0039 ; 0000-0003-4392-4548</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://dx.doi.org/10.1016/j.microrel.2014.07.134$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>230,309,310,314,777,781,786,787,882,3537,23911,23912,25121,27905,27906,45976</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=28961040$$DView record in Pascal Francis$$Hfree_for_read</backlink><backlink>$$Uhttps://hal.science/hal-01059962$$DView record in HAL$$Hfree_for_read</backlink></links><search><creatorcontrib>Phulpin, T.</creatorcontrib><creatorcontrib>Trémouilles, D.</creatorcontrib><creatorcontrib>Isoird, K.</creatorcontrib><creatorcontrib>Tournier, D.</creatorcontrib><creatorcontrib>Godignon, P.</creatorcontrib><creatorcontrib>Austin, P.</creatorcontrib><title>Analysis of an ESD failure mechanism on a SiC MESFET</title><title>Microelectronics and reliability</title><description>Efficient energy management become more and more crucial with increasing energy resource scarcity. Power electronic will play a major role in this field and thus require innovations like using wide band gap semiconductor to build power devices. SiC, GaN, diamond material-based devices are currently more or less mature and will sooner or later require investigations on their reliability to allow their wide adoption. In this work we investigate on the robustness of a SiC-MESFET to ElectroStatic-Discharge (ESD). Surprisingly the ESD robustness is rather low and found to be related to both current non-uniformity and a quite unexpected parasitic NPN bipolar transistor triggering. The outcome of this study allows proposing first guidelines to optimize ESD robustness of such devices.</description><subject>Applied sciences</subject><subject>Electrical engineering. Electrical power engineering</subject><subject>Electronic equipment and fabrication. Passive components, printed wiring boards, connectics</subject><subject>Electronics</subject><subject>Engineering Sciences</subject><subject>ESD</subject><subject>Exact sciences and technology</subject><subject>HBM robustness</subject><subject>Parasitic transistor</subject><subject>Power electronics, power supplies</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><subject>SiC MESFET</subject><subject>TCAD simulation</subject><subject>TLP stress</subject><subject>Transistors</subject><issn>0026-2714</issn><issn>1872-941X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2014</creationdate><recordtype>article</recordtype><recordid>eNqFkE9LAzEQxYMoWKtfQXLx4GHXSZomm5ulVitUPFTBW0jzh6Zsd0tSC_32Zlnt1dPA472ZNz-EbgmUBAh_2JTbYGIbXV1SIKwEUZIRO0MDUglaSEa-ztEAgPKCCsIu0VVKGwAQQMgAsUmj62MKCbce6wbPlk_Y61B_R4e3zqx1E9IWtw3WeBmm-G22fJ59XKMLr-vkbn7nEH1mdTovFu8vr9PJojBjzvYFswys1NxTkCteaQbUeM0M8FyTCvCUSmslCGcctd5psZK0kpyNKuuFWY2G6L7fu9a12sWw1fGoWh3UfLJQnQYExlJyeiDZy3tvRpFSdP4UIKA6Tmqj_jipjpMCoTKnHLzrgzudjK591I0J6ZTuChFgkH2Pvc_ljw_BRZVMcI1xNkRn9sq24b9TP4KTfp8</recordid><startdate>20140901</startdate><enddate>20140901</enddate><creator>Phulpin, T.</creator><creator>Trémouilles, D.</creator><creator>Isoird, K.</creator><creator>Tournier, D.</creator><creator>Godignon, P.</creator><creator>Austin, P.</creator><general>Elsevier Ltd</general><general>Elsevier</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>1XC</scope><scope>VOOES</scope><orcidid>https://orcid.org/0000-0002-2878-6952</orcidid><orcidid>https://orcid.org/0000-0001-8446-9129</orcidid><orcidid>https://orcid.org/0000-0001-7473-0039</orcidid><orcidid>https://orcid.org/0000-0003-4392-4548</orcidid></search><sort><creationdate>20140901</creationdate><title>Analysis of an ESD failure mechanism on a SiC MESFET</title><author>Phulpin, T. ; Trémouilles, D. ; Isoird, K. ; Tournier, D. ; Godignon, P. ; Austin, P.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c564t-4d40d9a6f209b68a402cfa4c06014270f229dd907ece2dfea7b92896438df7cb3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2014</creationdate><topic>Applied sciences</topic><topic>Electrical engineering. Electrical power engineering</topic><topic>Electronic equipment and fabrication. Passive components, printed wiring boards, connectics</topic><topic>Electronics</topic><topic>Engineering Sciences</topic><topic>ESD</topic><topic>Exact sciences and technology</topic><topic>HBM robustness</topic><topic>Parasitic transistor</topic><topic>Power electronics, power supplies</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><topic>SiC MESFET</topic><topic>TCAD simulation</topic><topic>TLP stress</topic><topic>Transistors</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Phulpin, T.</creatorcontrib><creatorcontrib>Trémouilles, D.</creatorcontrib><creatorcontrib>Isoird, K.</creatorcontrib><creatorcontrib>Tournier, D.</creatorcontrib><creatorcontrib>Godignon, P.</creatorcontrib><creatorcontrib>Austin, P.</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Hyper Article en Ligne (HAL)</collection><collection>Hyper Article en Ligne (HAL) (Open Access)</collection><jtitle>Microelectronics and reliability</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Phulpin, T.</au><au>Trémouilles, D.</au><au>Isoird, K.</au><au>Tournier, D.</au><au>Godignon, P.</au><au>Austin, P.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Analysis of an ESD failure mechanism on a SiC MESFET</atitle><jtitle>Microelectronics and reliability</jtitle><date>2014-09-01</date><risdate>2014</risdate><volume>54</volume><issue>9-10</issue><spage>2217</spage><epage>2221</epage><pages>2217-2221</pages><issn>0026-2714</issn><eissn>1872-941X</eissn><coden>MCRLAS</coden><abstract>Efficient energy management become more and more crucial with increasing energy resource scarcity. Power electronic will play a major role in this field and thus require innovations like using wide band gap semiconductor to build power devices. SiC, GaN, diamond material-based devices are currently more or less mature and will sooner or later require investigations on their reliability to allow their wide adoption. In this work we investigate on the robustness of a SiC-MESFET to ElectroStatic-Discharge (ESD). Surprisingly the ESD robustness is rather low and found to be related to both current non-uniformity and a quite unexpected parasitic NPN bipolar transistor triggering. The outcome of this study allows proposing first guidelines to optimize ESD robustness of such devices.</abstract><cop>Kidlington</cop><pub>Elsevier Ltd</pub><doi>10.1016/j.microrel.2014.07.134</doi><tpages>5</tpages><orcidid>https://orcid.org/0000-0002-2878-6952</orcidid><orcidid>https://orcid.org/0000-0001-8446-9129</orcidid><orcidid>https://orcid.org/0000-0001-7473-0039</orcidid><orcidid>https://orcid.org/0000-0003-4392-4548</orcidid><oa>free_for_read</oa></addata></record> |
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subjects | Applied sciences Electrical engineering. Electrical power engineering Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Engineering Sciences ESD Exact sciences and technology HBM robustness Parasitic transistor Power electronics, power supplies Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices SiC MESFET TCAD simulation TLP stress Transistors |
title | Analysis of an ESD failure mechanism on a SiC MESFET |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-18T08%3A49%3A18IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-hal_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Analysis%20of%20an%20ESD%20failure%20mechanism%20on%20a%20SiC%20MESFET&rft.jtitle=Microelectronics%20and%20reliability&rft.au=Phulpin,%20T.&rft.date=2014-09-01&rft.volume=54&rft.issue=9-10&rft.spage=2217&rft.epage=2221&rft.pages=2217-2221&rft.issn=0026-2714&rft.eissn=1872-941X&rft.coden=MCRLAS&rft_id=info:doi/10.1016/j.microrel.2014.07.134&rft_dat=%3Chal_cross%3Eoai_HAL_hal_01059962v1%3C/hal_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_els_id=S0026271414003369&rfr_iscdi=true |