Internal stresses and voids in SiC particle reinforced aluminum composites for heat sink applications

Metal-matrix composites (MMC) are being developed for power electronic IGBT modules, where the heat generated by the high power densities has to be dissipated from the chips into a heat sink. As a means of increasing long term stability a base plate material is needed with a good thermal conductivit...

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Veröffentlicht in:	Composites science and technology 2011-03, Vol.71 (5), p.724-733
Hauptverfasser:	Schöbel, M., Altendorfer, W., Degischer, H.P., Vaucher, S., Buslaps, T., Michiel, M. Di, Hofmann, M.
Format:	Artikel
Sprache:	eng
Schlagworte:	A. Metal-matrix composites Aluminum Applied sciences B. Porosity/voids B. Thermal properties C. Residual stress Ceramics D. Non-destructive testing Engineering Sciences Exact sciences and technology Materials Metal matrix composites Metals. Metallurgy Particulate composites Powder metallurgy. Composite materials Production techniques Residual stress Silicon carbide Sintered metals and alloys. Pseudo alloys. Cermets Stability Synchrotrons Voids
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