Experimental analysis and finite element modelling of nano-scratch test applied on 40–120 nm SiCN thin films deposited on Cu/Si substrate

In this work, the nano-scratch test is used to characterize the interfacial adhesion of amorphous SiCN thin films deposited by plasma enhanced chemical vapour deposition on Cu/Si substrates. The experimental results show that the critical load F c is directly related to the rupture of the SiCN/Cu in...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Veröffentlicht in:	Thin solid films 2010-05, Vol.518 (14), p.3859-3865
Hauptverfasser:	Roy, S., Darque-Ceretti, E., Felder, E., Raynal, F., Bispo, I.
Format:	Artikel
Sprache:	eng
Schlagworte:	Adhesion Chemical vapor deposition (including plasma-enhanced cvd, mocvd, etc.) Condensed matter: structure, mechanical and thermal properties Copper Cross-disciplinary physics: materials science rheology Engineering Sciences Exact sciences and technology Finite element modelling Materials Materials science Mechanical and acoustical properties Methods of deposition of films and coatings film growth and epitaxy Nano-scratch Physical properties of thin films, nonelectronic Physics SiCN Structure and morphology thickness Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties) Thin film structure and morphology Thin films
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!