Microstructural evolution and mechanical properties of SnAgCu alloys
Lead containing solder paste is now considered as an environmental threat. In order to eliminate this undesirable environmental impact associated to their production, a family of lead-free solder joint, Sn-3.8Ag-0.7Cu, is proposed. Microstructural and mechanical data of this solder joint have been a...
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| Veröffentlicht in: | Journal of applied physics 2006-08, Vol.100 (4), p.043519-043519-8 |
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| container_end_page | 043519-8 |
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| container_issue | 4 |
| container_start_page | 043519 |
| container_title | Journal of applied physics |
| container_volume | 100 |
| creator | Fouassier, O. Heintz, J.-M. Chazelas, J. Geffroy, P.-M. Silvain, J.-F. |
| description | Lead containing solder paste is now considered as an environmental threat. In order to eliminate this undesirable environmental impact associated to their production, a family of lead-free solder joint, Sn-3.8Ag-0.7Cu, is proposed. Microstructural and mechanical data of this solder joint have been acquired and compared with the most common used SnPb solder paste. The evolution of the microstructure as well as the failure mode and the mechanical properties of SnAgCu solder joint are discussed as a function of strain rate, annealing treatments, and testing temperature. Tensile tests have been performed, at temperatures ranging from
−
50
to
+
150
°
C
, on bulk samples. Changes of the mechanical properties of bulk tested samples are actually correlated with microstructural changes, as shown by transmission electronic microscopy investigations. |
| doi_str_mv | 10.1063/1.2244478 |
| format | Article |
| fullrecord | <record><control><sourceid>hal_cross</sourceid><recordid>TN_cdi_hal_primary_oai_HAL_hal_00111081v1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>oai_HAL_hal_00111081v1</sourcerecordid><originalsourceid>FETCH-LOGICAL-c353t-24f90a9935e614ef91f7d1c25894e1b90476bbfcd5ed90e192c918a5446e6af03</originalsourceid><addsrcrecordid>eNp1kM9LwzAUgIMoOKcH_4NePXTmNUnbdxHG_DFh4kE9hzRNXKRrStIO9t-7sqEgeAq8fO_B9xFyDXQGNGe3MMsyznlRnpAJ0BLTQgh6SiaUZpCWWOA5uYjxi1KAkuGE3L84HXzsw6D7IagmMVvfDL3zbaLaOtkYvVat0_uPLvjOhN6ZmHibvLXzz8WQqKbxu3hJzqxqork6vlPy8fjwvlimq9en58V8lWomWJ9m3CJViEyYHLixCLaoQWeiRG6gQsqLvKqsroWpkRrATCOUSnCem1xZyqbk5nB3rRrZBbdRYSe9cnI5X8lxNmrtrWELv-yoF4OxPwtA5ZhKgjym2rN3BzZq16tR_n_4Ty859mLfJF5wfQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype></control><display><type>article</type><title>Microstructural evolution and mechanical properties of SnAgCu alloys</title><source>AIP Journals Complete</source><source>AIP Digital Archive</source><creator>Fouassier, O. ; Heintz, J.-M. ; Chazelas, J. ; Geffroy, P.-M. ; Silvain, J.-F.</creator><creatorcontrib>Fouassier, O. ; Heintz, J.-M. ; Chazelas, J. ; Geffroy, P.-M. ; Silvain, J.-F.</creatorcontrib><description>Lead containing solder paste is now considered as an environmental threat. In order to eliminate this undesirable environmental impact associated to their production, a family of lead-free solder joint, Sn-3.8Ag-0.7Cu, is proposed. Microstructural and mechanical data of this solder joint have been acquired and compared with the most common used SnPb solder paste. The evolution of the microstructure as well as the failure mode and the mechanical properties of SnAgCu solder joint are discussed as a function of strain rate, annealing treatments, and testing temperature. Tensile tests have been performed, at temperatures ranging from
−
50
to
+
150
°
C
, on bulk samples. Changes of the mechanical properties of bulk tested samples are actually correlated with microstructural changes, as shown by transmission electronic microscopy investigations.</description><identifier>ISSN: 0021-8979</identifier><identifier>EISSN: 1089-7550</identifier><identifier>DOI: 10.1063/1.2244478</identifier><identifier>CODEN: JAPIAU</identifier><language>eng</language><publisher>American Institute of Physics</publisher><subject>Chemical Sciences ; Condensed Matter ; Material chemistry ; Materials Science ; Physics</subject><ispartof>Journal of applied physics, 2006-08, Vol.100 (4), p.043519-043519-8</ispartof><rights>2006 American Institute of Physics</rights><rights>Distributed under a Creative Commons Attribution 4.0 International License</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c353t-24f90a9935e614ef91f7d1c25894e1b90476bbfcd5ed90e192c918a5446e6af03</citedby><cites>FETCH-LOGICAL-c353t-24f90a9935e614ef91f7d1c25894e1b90476bbfcd5ed90e192c918a5446e6af03</cites><orcidid>0000-0002-1082-5714 ; 0000-0002-5881-6833</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://pubs.aip.org/jap/article-lookup/doi/10.1063/1.2244478$$EHTML$$P50$$Gscitation$$H</linktohtml><link.rule.ids>230,314,776,780,790,881,1553,4497,27903,27904,76131,76137</link.rule.ids><backlink>$$Uhttps://hal.science/hal-00111081$$DView record in HAL$$Hfree_for_read</backlink></links><search><creatorcontrib>Fouassier, O.</creatorcontrib><creatorcontrib>Heintz, J.-M.</creatorcontrib><creatorcontrib>Chazelas, J.</creatorcontrib><creatorcontrib>Geffroy, P.-M.</creatorcontrib><creatorcontrib>Silvain, J.-F.</creatorcontrib><title>Microstructural evolution and mechanical properties of SnAgCu alloys</title><title>Journal of applied physics</title><description>Lead containing solder paste is now considered as an environmental threat. In order to eliminate this undesirable environmental impact associated to their production, a family of lead-free solder joint, Sn-3.8Ag-0.7Cu, is proposed. Microstructural and mechanical data of this solder joint have been acquired and compared with the most common used SnPb solder paste. The evolution of the microstructure as well as the failure mode and the mechanical properties of SnAgCu solder joint are discussed as a function of strain rate, annealing treatments, and testing temperature. Tensile tests have been performed, at temperatures ranging from
−
50
to
+
150
°
C
, on bulk samples. Changes of the mechanical properties of bulk tested samples are actually correlated with microstructural changes, as shown by transmission electronic microscopy investigations.</description><subject>Chemical Sciences</subject><subject>Condensed Matter</subject><subject>Material chemistry</subject><subject>Materials Science</subject><subject>Physics</subject><issn>0021-8979</issn><issn>1089-7550</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2006</creationdate><recordtype>article</recordtype><recordid>eNp1kM9LwzAUgIMoOKcH_4NePXTmNUnbdxHG_DFh4kE9hzRNXKRrStIO9t-7sqEgeAq8fO_B9xFyDXQGNGe3MMsyznlRnpAJ0BLTQgh6SiaUZpCWWOA5uYjxi1KAkuGE3L84HXzsw6D7IagmMVvfDL3zbaLaOtkYvVat0_uPLvjOhN6ZmHibvLXzz8WQqKbxu3hJzqxqork6vlPy8fjwvlimq9en58V8lWomWJ9m3CJViEyYHLixCLaoQWeiRG6gQsqLvKqsroWpkRrATCOUSnCem1xZyqbk5nB3rRrZBbdRYSe9cnI5X8lxNmrtrWELv-yoF4OxPwtA5ZhKgjym2rN3BzZq16tR_n_4Ty859mLfJF5wfQ</recordid><startdate>20060815</startdate><enddate>20060815</enddate><creator>Fouassier, O.</creator><creator>Heintz, J.-M.</creator><creator>Chazelas, J.</creator><creator>Geffroy, P.-M.</creator><creator>Silvain, J.-F.</creator><general>American Institute of Physics</general><scope>AAYXX</scope><scope>CITATION</scope><scope>1XC</scope><scope>VOOES</scope><orcidid>https://orcid.org/0000-0002-1082-5714</orcidid><orcidid>https://orcid.org/0000-0002-5881-6833</orcidid></search><sort><creationdate>20060815</creationdate><title>Microstructural evolution and mechanical properties of SnAgCu alloys</title><author>Fouassier, O. ; Heintz, J.-M. ; Chazelas, J. ; Geffroy, P.-M. ; Silvain, J.-F.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c353t-24f90a9935e614ef91f7d1c25894e1b90476bbfcd5ed90e192c918a5446e6af03</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2006</creationdate><topic>Chemical Sciences</topic><topic>Condensed Matter</topic><topic>Material chemistry</topic><topic>Materials Science</topic><topic>Physics</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Fouassier, O.</creatorcontrib><creatorcontrib>Heintz, J.-M.</creatorcontrib><creatorcontrib>Chazelas, J.</creatorcontrib><creatorcontrib>Geffroy, P.-M.</creatorcontrib><creatorcontrib>Silvain, J.-F.</creatorcontrib><collection>CrossRef</collection><collection>Hyper Article en Ligne (HAL)</collection><collection>Hyper Article en Ligne (HAL) (Open Access)</collection><jtitle>Journal of applied physics</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Fouassier, O.</au><au>Heintz, J.-M.</au><au>Chazelas, J.</au><au>Geffroy, P.-M.</au><au>Silvain, J.-F.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Microstructural evolution and mechanical properties of SnAgCu alloys</atitle><jtitle>Journal of applied physics</jtitle><date>2006-08-15</date><risdate>2006</risdate><volume>100</volume><issue>4</issue><spage>043519</spage><epage>043519-8</epage><pages>043519-043519-8</pages><issn>0021-8979</issn><eissn>1089-7550</eissn><coden>JAPIAU</coden><abstract>Lead containing solder paste is now considered as an environmental threat. In order to eliminate this undesirable environmental impact associated to their production, a family of lead-free solder joint, Sn-3.8Ag-0.7Cu, is proposed. Microstructural and mechanical data of this solder joint have been acquired and compared with the most common used SnPb solder paste. The evolution of the microstructure as well as the failure mode and the mechanical properties of SnAgCu solder joint are discussed as a function of strain rate, annealing treatments, and testing temperature. Tensile tests have been performed, at temperatures ranging from
−
50
to
+
150
°
C
, on bulk samples. Changes of the mechanical properties of bulk tested samples are actually correlated with microstructural changes, as shown by transmission electronic microscopy investigations.</abstract><pub>American Institute of Physics</pub><doi>10.1063/1.2244478</doi><orcidid>https://orcid.org/0000-0002-1082-5714</orcidid><orcidid>https://orcid.org/0000-0002-5881-6833</orcidid><oa>free_for_read</oa></addata></record> |
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| ispartof | Journal of applied physics, 2006-08, Vol.100 (4), p.043519-043519-8 |
| issn | 0021-8979 1089-7550 |
| language | eng |
| recordid | cdi_hal_primary_oai_HAL_hal_00111081v1 |
| source | AIP Journals Complete; AIP Digital Archive |
| subjects | Chemical Sciences Condensed Matter Material chemistry Materials Science Physics |
| title | Microstructural evolution and mechanical properties of SnAgCu alloys |
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