Three-dimensional simulation of microchip encapsulation process

A finite element simulation of moving boundaries in a three‐dimensional inertiafree, incompressible flow is presented. A control volume scheme with a fixed finite element mesh is employed to predict fluid front advancement. Fluid front advancement and pressure variation in a flow domain similar to t...

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Veröffentlicht in:	Polymer engineering and science 2000-03, Vol.40 (3), p.776-785
Hauptverfasser:	Han, Ruihua, Shi, Linhuo, Gupta, Mahesh
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Exact sciences and technology Fluid dynamics Integrated circuits Molding Plastics Semiconductor chips
Online-Zugang:	Volltext
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