Investigation of the Fabrication of Diamond/SiC Composites Using α-Si[sub.3]N[sub.4]/Si Infiltration

Diamond/SiC (Dia/SiC) composites possess excellent properties, such as high thermal conductivity and low thermal expansion coefficient. In addition, they are suitable as electronic packaging materials. This study mainly optimized the diamond particle size packing and liquid-phase silicon infiltratio...

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Veröffentlicht in:	Materials 2023-09, Vol.16 (18)
Hauptverfasser:	Xing, Bo, Zhang, Yingfan, Zhao, Jinzhui, Wang, Jianyu, Huang, Guoqin
Format:	Artikel
Sprache:	eng
Schlagworte:	Composite materials industry Electronic equipment and supplies Force and energy Powders Silicon Technology application
Online-Zugang:	Volltext
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