Numerical study on performance enhancement of a square enclosure with circular cylinder of varying geometries

Extensive use of electronic components produces a lot of heat, and due to this heat the efficiency of the component degrades. To overcome this issue, a proper heat dissipation is needed, and this can be carried out using natural convection. This paper presents the numerical investigation of the heat...

Ausführliche Beschreibung

Bibliographische Detailangaben

Veröffentlicht in:	Journal of thermal analysis and calorimetry 2022-02, Vol.147 (3), p.2579-2599
Hauptverfasser:	Jain, S. Ronak, Subhani, Shaik, Kumar, Rajendran Senthil
Format:	Artikel
Sprache:	eng
Schlagworte:	Analytical Chemistry Chemistry Chemistry and Materials Science Electronic components industry Inorganic Chemistry Measurement Science and Instrumentation Nuclear energy Physical Chemistry Polymer Sciences
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!