Low temperature TLP bonding of [Al.sub.2][O.sub.3]-ceramics using eutectic Au- alloys

In this study, [Al.sub.2][O.sub.3]-ceramics were joined via TLP bonding using interlayers of eutectic Au-12Ge (wt%) and Au-3Si (wt%) solder alloys, respectively, with a melting temperature of 361 and 363°C and Ni wetting layers. The Ni layers were part of a metallic multilayer coating (Ti/W/Ni) appl...

Ausführliche Beschreibung

Bibliographische Detailangaben

Veröffentlicht in:	Journal of materials science 2013-10, Vol.48 (20), p.7115
Hauptverfasser:	Weyrich, Nico, Leinenbach, Christian
Format:	Artikel
Sprache:	eng
Schlagworte:	Alloys Ceramic materials Ceramics Coatings Mechanical properties Specialty metals industry
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!