LAYERED HEAT-DISSIPATION LIQUID COOLING CABINET
A layered heat-dissipation liquid cooling cabinet is disclosed including a cabinet, layered racks, and a plurality of liquid cooling components. A plurality of modules are plugged into each layered rack. The layered racks are vertically distributed in the cabinet. A plurality of the liquid cooling c...
Gespeichert in:
Hauptverfasser: | , , , |
---|---|
Format: | Patent |
Sprache: | eng |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | LIU, Yun ZHAN, Haoqin XU, Weishu LI, Xueyan |
description | A layered heat-dissipation liquid cooling cabinet is disclosed including a cabinet, layered racks, and a plurality of liquid cooling components. A plurality of modules are plugged into each layered rack. The layered racks are vertically distributed in the cabinet. A plurality of the liquid cooling components and the layered racks are distributed apart. Each layered rack is arranged into a frame structure with openings at two ends. The top of the layered rack is provided with ventilation holes. Gap grooves are provided between adjacent modules in the layered rack. A perforation is provided on a bottom inner wall of each gap groove. Heat gas between different layered racks is separated to prevent heat overload caused by concentration of overall heat in the cabinet on a top end thereof and enable the perforations to be communicated up and down when a region where a layered rack is overheated due to operation. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_ZA202309889B</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>ZA202309889B</sourcerecordid><originalsourceid>FETCH-epo_espacenet_ZA202309889B3</originalsourceid><addsrcrecordid>eNrjZND3cYx0DXJ1UfBwdQzRdfEMDvYMcAzx9PdT8PEMDPV0UXD29_fx9HNXcHZ08vRzDeFhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfFRjkYGRsYGlhYWlk7GxKgBAArZJiM</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>LAYERED HEAT-DISSIPATION LIQUID COOLING CABINET</title><source>esp@cenet</source><creator>LIU, Yun ; ZHAN, Haoqin ; XU, Weishu ; LI, Xueyan</creator><creatorcontrib>LIU, Yun ; ZHAN, Haoqin ; XU, Weishu ; LI, Xueyan</creatorcontrib><description>A layered heat-dissipation liquid cooling cabinet is disclosed including a cabinet, layered racks, and a plurality of liquid cooling components. A plurality of modules are plugged into each layered rack. The layered racks are vertically distributed in the cabinet. A plurality of the liquid cooling components and the layered racks are distributed apart. Each layered rack is arranged into a frame structure with openings at two ends. The top of the layered rack is provided with ventilation holes. Gap grooves are provided between adjacent modules in the layered rack. A perforation is provided on a bottom inner wall of each gap groove. Heat gas between different layered racks is separated to prevent heat overload caused by concentration of overall heat in the cabinet on a top end thereof and enable the perforations to be communicated up and down when a region where a layered rack is overheated due to operation.</description><language>eng</language><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240530&DB=EPODOC&CC=ZA&NR=202309889B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240530&DB=EPODOC&CC=ZA&NR=202309889B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIU, Yun</creatorcontrib><creatorcontrib>ZHAN, Haoqin</creatorcontrib><creatorcontrib>XU, Weishu</creatorcontrib><creatorcontrib>LI, Xueyan</creatorcontrib><title>LAYERED HEAT-DISSIPATION LIQUID COOLING CABINET</title><description>A layered heat-dissipation liquid cooling cabinet is disclosed including a cabinet, layered racks, and a plurality of liquid cooling components. A plurality of modules are plugged into each layered rack. The layered racks are vertically distributed in the cabinet. A plurality of the liquid cooling components and the layered racks are distributed apart. Each layered rack is arranged into a frame structure with openings at two ends. The top of the layered rack is provided with ventilation holes. Gap grooves are provided between adjacent modules in the layered rack. A perforation is provided on a bottom inner wall of each gap groove. Heat gas between different layered racks is separated to prevent heat overload caused by concentration of overall heat in the cabinet on a top end thereof and enable the perforations to be communicated up and down when a region where a layered rack is overheated due to operation.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZND3cYx0DXJ1UfBwdQzRdfEMDvYMcAzx9PdT8PEMDPV0UXD29_fx9HNXcHZ08vRzDeFhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfFRjkYGRsYGlhYWlk7GxKgBAArZJiM</recordid><startdate>20240530</startdate><enddate>20240530</enddate><creator>LIU, Yun</creator><creator>ZHAN, Haoqin</creator><creator>XU, Weishu</creator><creator>LI, Xueyan</creator><scope>EVB</scope></search><sort><creationdate>20240530</creationdate><title>LAYERED HEAT-DISSIPATION LIQUID COOLING CABINET</title><author>LIU, Yun ; ZHAN, Haoqin ; XU, Weishu ; LI, Xueyan</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_ZA202309889B3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><toplevel>online_resources</toplevel><creatorcontrib>LIU, Yun</creatorcontrib><creatorcontrib>ZHAN, Haoqin</creatorcontrib><creatorcontrib>XU, Weishu</creatorcontrib><creatorcontrib>LI, Xueyan</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIU, Yun</au><au>ZHAN, Haoqin</au><au>XU, Weishu</au><au>LI, Xueyan</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LAYERED HEAT-DISSIPATION LIQUID COOLING CABINET</title><date>2024-05-30</date><risdate>2024</risdate><abstract>A layered heat-dissipation liquid cooling cabinet is disclosed including a cabinet, layered racks, and a plurality of liquid cooling components. A plurality of modules are plugged into each layered rack. The layered racks are vertically distributed in the cabinet. A plurality of the liquid cooling components and the layered racks are distributed apart. Each layered rack is arranged into a frame structure with openings at two ends. The top of the layered rack is provided with ventilation holes. Gap grooves are provided between adjacent modules in the layered rack. A perforation is provided on a bottom inner wall of each gap groove. Heat gas between different layered racks is separated to prevent heat overload caused by concentration of overall heat in the cabinet on a top end thereof and enable the perforations to be communicated up and down when a region where a layered rack is overheated due to operation.</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | eng |
recordid | cdi_epo_espacenet_ZA202309889B |
source | esp@cenet |
title | LAYERED HEAT-DISSIPATION LIQUID COOLING CABINET |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-29T19%3A03%3A24IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LIU,%20Yun&rft.date=2024-05-30&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EZA202309889B%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |