ULTRAHIGH MOLECULAR WEIGHT POLYETHYLENE COMPOSITE FOR PRINTED CIRCUIT BOARD AND ANTENNA BASE MATERIAL
An ultrahigh molecular weight polyethylene (UHMWPE) composite (12) for use in printed circuit board or antenna base material. A base material includes at least one dielectric layer which comprises of an ultrahigh molecular weight polyethylene composite (12) and at least one electroconductive layer (...
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| creator | COHEN, YACHIN VAYKHANSKY, LEV REIN, DIMITRI |
| description | An ultrahigh molecular weight polyethylene (UHMWPE) composite (12) for use in printed circuit board or antenna base material. A base material includes at least one dielectric layer which comprises of an ultrahigh molecular weight polyethylene composite (12) and at least one electroconductive layer (16) which comprises of an electroconductive material; the dielectric and electroconductive layers being intimately bonded to one another.
La présente invention concerne un composite en polyéthylène de poids moléculaire très élevé (UHMWPE) (12) destiné à être utilisé dans des plaquettes de circuits imprimés ou des matériaux de base pour antennes. Un matériau de base comprend au moins une couche diélectrique contenant un composite en polyéthylène de poids moléculaire très élevé (12), et au moins une couche électroconductrice (16) comprenant un matériau électroconducteur. Les couches diélectrique et électroconductrice sont par ailleurs intimement fixées ensemble. |
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La présente invention concerne un composite en polyéthylène de poids moléculaire très élevé (UHMWPE) (12) destiné à être utilisé dans des plaquettes de circuits imprimés ou des matériaux de base pour antennes. Un matériau de base comprend au moins une couche diélectrique contenant un composite en polyéthylène de poids moléculaire très élevé (12), et au moins une couche électroconductrice (16) comprenant un matériau électroconducteur. Les couches diélectrique et électroconductrice sont par ailleurs intimement fixées ensemble.</description><edition>6</edition><language>eng ; fre</language><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERAL PROCESSES OF COMPOUNDING ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING ; WORKING-UP</subject><creationdate>1999</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19990610&DB=EPODOC&CC=WO&NR=9928127A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25555,76308</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19990610&DB=EPODOC&CC=WO&NR=9928127A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>COHEN, YACHIN</creatorcontrib><creatorcontrib>VAYKHANSKY, LEV</creatorcontrib><creatorcontrib>REIN, DIMITRI</creatorcontrib><title>ULTRAHIGH MOLECULAR WEIGHT POLYETHYLENE COMPOSITE FOR PRINTED CIRCUIT BOARD AND ANTENNA BASE MATERIAL</title><description>An ultrahigh molecular weight polyethylene (UHMWPE) composite (12) for use in printed circuit board or antenna base material. A base material includes at least one dielectric layer which comprises of an ultrahigh molecular weight polyethylene composite (12) and at least one electroconductive layer (16) which comprises of an electroconductive material; the dielectric and electroconductive layers being intimately bonded to one another.
La présente invention concerne un composite en polyéthylène de poids moléculaire très élevé (UHMWPE) (12) destiné à être utilisé dans des plaquettes de circuits imprimés ou des matériaux de base pour antennes. Un matériau de base comprend au moins une couche diélectrique contenant un composite en polyéthylène de poids moléculaire très élevé (12), et au moins une couche électroconductrice (16) comprenant un matériau électroconducteur. Les couches diélectrique et électroconductrice sont par ailleurs intimement fixées ensemble.</description><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>TRANSPORTING</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1999</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNisEKgkAQQL10iOof5gc8aIfyOK5ju7DuyDginkRiO0UJ9v9U0Ad0eDwevG0Se6-C1l0sNOzJ9B4FBvq0Qst-JLWjp0BguGm5c0pQs0ArLihVYJyY3imUjFIBhi9KISCU2BE0qCQO_T7Z3Ob7Gg8_7xKoSY1N4_Kc4rrM1_iIr2ngosjPWX7C7PjH8gZOUjTF</recordid><startdate>19990610</startdate><enddate>19990610</enddate><creator>COHEN, YACHIN</creator><creator>VAYKHANSKY, LEV</creator><creator>REIN, DIMITRI</creator><scope>EVB</scope></search><sort><creationdate>19990610</creationdate><title>ULTRAHIGH MOLECULAR WEIGHT POLYETHYLENE COMPOSITE FOR PRINTED CIRCUIT BOARD AND ANTENNA BASE MATERIAL</title><author>COHEN, YACHIN ; VAYKHANSKY, LEV ; REIN, DIMITRI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO9928127A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>1999</creationdate><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>TRANSPORTING</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>COHEN, YACHIN</creatorcontrib><creatorcontrib>VAYKHANSKY, LEV</creatorcontrib><creatorcontrib>REIN, DIMITRI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>COHEN, YACHIN</au><au>VAYKHANSKY, LEV</au><au>REIN, DIMITRI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ULTRAHIGH MOLECULAR WEIGHT POLYETHYLENE COMPOSITE FOR PRINTED CIRCUIT BOARD AND ANTENNA BASE MATERIAL</title><date>1999-06-10</date><risdate>1999</risdate><abstract>An ultrahigh molecular weight polyethylene (UHMWPE) composite (12) for use in printed circuit board or antenna base material. A base material includes at least one dielectric layer which comprises of an ultrahigh molecular weight polyethylene composite (12) and at least one electroconductive layer (16) which comprises of an electroconductive material; the dielectric and electroconductive layers being intimately bonded to one another.
La présente invention concerne un composite en polyéthylène de poids moléculaire très élevé (UHMWPE) (12) destiné à être utilisé dans des plaquettes de circuits imprimés ou des matériaux de base pour antennes. Un matériau de base comprend au moins une couche diélectrique contenant un composite en polyéthylène de poids moléculaire très élevé (12), et au moins une couche électroconductrice (16) comprenant un matériau électroconducteur. Les couches diélectrique et électroconductrice sont par ailleurs intimement fixées ensemble.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP |
| title | ULTRAHIGH MOLECULAR WEIGHT POLYETHYLENE COMPOSITE FOR PRINTED CIRCUIT BOARD AND ANTENNA BASE MATERIAL |
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