METHOD OF PROTECTING THE SURFACE OF A FOIL, RELEASABLY ADHERING PROTECTIVE FILM AND FILM-COATED FOIL

A method for protecting a substrate sheet (46) such as a conductive foil suitable for use in the manufacture of printed circuit boards involving applying a lamination mold-release layer (28) to one side of a protective film (12), and applying a preferably electron beam curable adhesive pressure-sens...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KEOUGH, ALLEN, H, WILHEIM, MARTIN, J
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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