TAPERED STRUCTURE SUITABLE FOR MICROTHERMOCOUPLES MICROELECTRODES, FIELD EMISSION TIPS AND MICROMAGNETIC SENSORS WITH FORCE SENSING CAPABILITIES

A tapered, nonconductive structure (10) having a hollow core (18) and a conical tip (14) includes a metal wire (16) within the core (18). The wire (16) is sealed within, and is exposed at the end (22) of, the tip (14). An electrically conductive or semiconductive layer (24) on the exterior of the ti...

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Hauptverfasser: KOKOTOV, SOFIA, FISH, GALINA, LEWIS, AARON, LIBERMAN, KLONI
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Sprache:eng ; fre
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FISH, GALINA
LEWIS, AARON
LIBERMAN, KLONI
description A tapered, nonconductive structure (10) having a hollow core (18) and a conical tip (14) includes a metal wire (16) within the core (18). The wire (16) is sealed within, and is exposed at the end (22) of, the tip (14). An electrically conductive or semiconductive layer (24) on the exterior of the tip (14) form a point thermocouple contact with the wire. The tip (14) may be fabricated, for example, by placing a metal wire (16) within a tube (12), and heating and pulling the tube (12) to produce two tapered micropipettes. Thereafter, a thin metal or semiconductor film (24) is evaporated onto the outer surface. Cette structure (10) conique, non conductrice et présentant une âme (18) creuse ainsi qu'une pointe (14) conique, comprend un fil (16) métallique logé dans l'âme (18). Ce fil (16) est scellé dans la pointe (14) et il est à nu au niveau de l'extrémité (22) de celle-ci. Une couche (24) électroconductrice ou semi-conductrice, déposée sur l'extérieur de la pointe (14), forme un contact ponctuel de thermocouple avec le fil. On peut fabriquer cette pointe (14), par exemple en plaçant un fil (16) métallique dans un tube (12), puis en chauffant le tube (12) et en l'étirant afin d'obtenir deux micropipettes coniques. Ensuite, on forme par évaporation une couche (24) mince semi-conductrice ou métallique sur la surface extérieure de la pointe.
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The wire (16) is sealed within, and is exposed at the end (22) of, the tip (14). An electrically conductive or semiconductive layer (24) on the exterior of the tip (14) form a point thermocouple contact with the wire. The tip (14) may be fabricated, for example, by placing a metal wire (16) within a tube (12), and heating and pulling the tube (12) to produce two tapered micropipettes. Thereafter, a thin metal or semiconductor film (24) is evaporated onto the outer surface. Cette structure (10) conique, non conductrice et présentant une âme (18) creuse ainsi qu'une pointe (14) conique, comprend un fil (16) métallique logé dans l'âme (18). Ce fil (16) est scellé dans la pointe (14) et il est à nu au niveau de l'extrémité (22) de celle-ci. Une couche (24) électroconductrice ou semi-conductrice, déposée sur l'extérieur de la pointe (14), forme un contact ponctuel de thermocouple avec le fil. On peut fabriquer cette pointe (14), par exemple en plaçant un fil (16) métallique dans un tube (12), puis en chauffant le tube (12) et en l'étirant afin d'obtenir deux micropipettes coniques. Ensuite, on forme par évaporation une couche (24) mince semi-conductrice ou métallique sur la surface extérieure de la pointe.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record>
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subjects APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBEMICROSCOPY [SPM]
BASIC ELECTRIC ELEMENTS
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRICITY
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
MEASURING ANGLES
MEASURING AREAS
MEASURING ELECTRIC VARIABLES
MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS
MEASURING MAGNETIC VARIABLES
MEASURING QUANTITY OF HEAT
MEASURING TEMPERATURE
PHYSICS
SCANNING-PROBE TECHNIQUES OR APPARATUS
TESTING
THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
title TAPERED STRUCTURE SUITABLE FOR MICROTHERMOCOUPLES MICROELECTRODES, FIELD EMISSION TIPS AND MICROMAGNETIC SENSORS WITH FORCE SENSING CAPABILITIES
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