SOLDER DEPOSITING COMPOSITION AND METHOD OF PACKAGING USING THE SAME
A solder depositing composition containing a powdery Sn-Pb alloy and a lead salt of an organic acid as the essential components and depositing solder by the displacement reaction between the Sn atom of the alloy and the Pb ion of the organic acid salt. The packaging method comprises the steps of sup...
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| creator | FUKUNAGA, TAKAO FUJIWARA, TAKAHIRO SHIROISHI, HIROKAZU KUMAMOTO, SEISHI HIGASA, KAZUHITO KATAYAMA, NORIKO |
| description | A solder depositing composition containing a powdery Sn-Pb alloy and a lead salt of an organic acid as the essential components and depositing solder by the displacement reaction between the Sn atom of the alloy and the Pb ion of the organic acid salt. The packaging method comprises the steps of supplying the solder depositing composition to a conductive part formed on a substrate, forming a solder precoat on the conductive part by heating the supplied composition to deposit solder by the displacement reaction between the Sn atom and the Pb ion, mounting elements on the solder precoat thus formed, and packaging the elements on the conductive part by melting the precoat.
Une composition pour dépôt de soudrue contient un alliage de poudre de Sn-Pb et un sel de plomb d'un acide organique en guise d'éléments essentiels, et on obtient un dépôt de soudure par réaction de déplacement entre l'atome de Sn de l'alliage et l'ion Pb du sel d'acide organique. Le procédé d'encapsulation consiste à placer cette composition pour dépôt de soudure sur une partie conductrice placée sur un substrat, à former un prérevêtement de soudure sur cette partie conductrice en chauffant la composition ainsi placée pour déposer la soudure par réaction de déplacement entre l'atome de Sn et l'ion de Pb, à monter des éléments sur le prérevêtement de soudure ainsi formé, et à encapsuler ces éléments sur la partie conductrice en faisant fondre ce prérevêtement. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_WO9515834A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>WO9515834A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_WO9515834A13</originalsourceid><addsrcrecordid>eNrjZHAJ9vdxcQ1ScHEN8A_2DPH0c1dw9veFsP39FBz9XBR8XUM8_F0U_N0UAhydvR3dQWpCg0FkiIerQrCjrysPA2taYk5xKi-U5mZQcHMNcfbQTS3Ij08tLkhMTs1LLYkP97c0NTS1MDZxNDQmQgkAAlYraQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SOLDER DEPOSITING COMPOSITION AND METHOD OF PACKAGING USING THE SAME</title><source>esp@cenet</source><creator>FUKUNAGA, TAKAO ; FUJIWARA, TAKAHIRO ; SHIROISHI, HIROKAZU ; KUMAMOTO, SEISHI ; HIGASA, KAZUHITO ; KATAYAMA, NORIKO</creator><creatorcontrib>FUKUNAGA, TAKAO ; FUJIWARA, TAKAHIRO ; SHIROISHI, HIROKAZU ; KUMAMOTO, SEISHI ; HIGASA, KAZUHITO ; KATAYAMA, NORIKO</creatorcontrib><description>A solder depositing composition containing a powdery Sn-Pb alloy and a lead salt of an organic acid as the essential components and depositing solder by the displacement reaction between the Sn atom of the alloy and the Pb ion of the organic acid salt. The packaging method comprises the steps of supplying the solder depositing composition to a conductive part formed on a substrate, forming a solder precoat on the conductive part by heating the supplied composition to deposit solder by the displacement reaction between the Sn atom and the Pb ion, mounting elements on the solder precoat thus formed, and packaging the elements on the conductive part by melting the precoat.
Une composition pour dépôt de soudrue contient un alliage de poudre de Sn-Pb et un sel de plomb d'un acide organique en guise d'éléments essentiels, et on obtient un dépôt de soudure par réaction de déplacement entre l'atome de Sn de l'alliage et l'ion Pb du sel d'acide organique. Le procédé d'encapsulation consiste à placer cette composition pour dépôt de soudure sur une partie conductrice placée sur un substrat, à former un prérevêtement de soudure sur cette partie conductrice en chauffant la composition ainsi placée pour déposer la soudure par réaction de déplacement entre l'atome de Sn et l'ion de Pb, à monter des éléments sur le prérevêtement de soudure ainsi formé, et à encapsuler ces éléments sur la partie conductrice en faisant fondre ce prérevêtement.</description><edition>6</edition><language>eng ; fre ; jpn</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC ; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS ; MACHINE TOOLS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SOLDERING OR UNSOLDERING ; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ; TECHNICAL SUBJECTS COVERED BY FORMER USPC ; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>1995</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19950615&DB=EPODOC&CC=WO&NR=9515834A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19950615&DB=EPODOC&CC=WO&NR=9515834A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FUKUNAGA, TAKAO</creatorcontrib><creatorcontrib>FUJIWARA, TAKAHIRO</creatorcontrib><creatorcontrib>SHIROISHI, HIROKAZU</creatorcontrib><creatorcontrib>KUMAMOTO, SEISHI</creatorcontrib><creatorcontrib>HIGASA, KAZUHITO</creatorcontrib><creatorcontrib>KATAYAMA, NORIKO</creatorcontrib><title>SOLDER DEPOSITING COMPOSITION AND METHOD OF PACKAGING USING THE SAME</title><description>A solder depositing composition containing a powdery Sn-Pb alloy and a lead salt of an organic acid as the essential components and depositing solder by the displacement reaction between the Sn atom of the alloy and the Pb ion of the organic acid salt. The packaging method comprises the steps of supplying the solder depositing composition to a conductive part formed on a substrate, forming a solder precoat on the conductive part by heating the supplied composition to deposit solder by the displacement reaction between the Sn atom and the Pb ion, mounting elements on the solder precoat thus formed, and packaging the elements on the conductive part by melting the precoat.
Une composition pour dépôt de soudrue contient un alliage de poudre de Sn-Pb et un sel de plomb d'un acide organique en guise d'éléments essentiels, et on obtient un dépôt de soudure par réaction de déplacement entre l'atome de Sn de l'alliage et l'ion Pb du sel d'acide organique. Le procédé d'encapsulation consiste à placer cette composition pour dépôt de soudure sur une partie conductrice placée sur un substrat, à former un prérevêtement de soudure sur cette partie conductrice en chauffant la composition ainsi placée pour déposer la soudure par réaction de déplacement entre l'atome de Sn et l'ion de Pb, à monter des éléments sur le prérevêtement de soudure ainsi formé, et à encapsuler ces éléments sur la partie conductrice en faisant fondre ce prérevêtement.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</subject><subject>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</subject><subject>MACHINE TOOLS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1995</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAJ9vdxcQ1ScHEN8A_2DPH0c1dw9veFsP39FBz9XBR8XUM8_F0U_N0UAhydvR3dQWpCg0FkiIerQrCjrysPA2taYk5xKi-U5mZQcHMNcfbQTS3Ij08tLkhMTs1LLYkP97c0NTS1MDZxNDQmQgkAAlYraQ</recordid><startdate>19950615</startdate><enddate>19950615</enddate><creator>FUKUNAGA, TAKAO</creator><creator>FUJIWARA, TAKAHIRO</creator><creator>SHIROISHI, HIROKAZU</creator><creator>KUMAMOTO, SEISHI</creator><creator>HIGASA, KAZUHITO</creator><creator>KATAYAMA, NORIKO</creator><scope>EVB</scope></search><sort><creationdate>19950615</creationdate><title>SOLDER DEPOSITING COMPOSITION AND METHOD OF PACKAGING USING THE SAME</title><author>FUKUNAGA, TAKAO ; FUJIWARA, TAKAHIRO ; SHIROISHI, HIROKAZU ; KUMAMOTO, SEISHI ; HIGASA, KAZUHITO ; KATAYAMA, NORIKO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO9515834A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; jpn</language><creationdate>1995</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</topic><topic>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</topic><topic>MACHINE TOOLS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>FUKUNAGA, TAKAO</creatorcontrib><creatorcontrib>FUJIWARA, TAKAHIRO</creatorcontrib><creatorcontrib>SHIROISHI, HIROKAZU</creatorcontrib><creatorcontrib>KUMAMOTO, SEISHI</creatorcontrib><creatorcontrib>HIGASA, KAZUHITO</creatorcontrib><creatorcontrib>KATAYAMA, NORIKO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FUKUNAGA, TAKAO</au><au>FUJIWARA, TAKAHIRO</au><au>SHIROISHI, HIROKAZU</au><au>KUMAMOTO, SEISHI</au><au>HIGASA, KAZUHITO</au><au>KATAYAMA, NORIKO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SOLDER DEPOSITING COMPOSITION AND METHOD OF PACKAGING USING THE SAME</title><date>1995-06-15</date><risdate>1995</risdate><abstract>A solder depositing composition containing a powdery Sn-Pb alloy and a lead salt of an organic acid as the essential components and depositing solder by the displacement reaction between the Sn atom of the alloy and the Pb ion of the organic acid salt. The packaging method comprises the steps of supplying the solder depositing composition to a conductive part formed on a substrate, forming a solder precoat on the conductive part by heating the supplied composition to deposit solder by the displacement reaction between the Sn atom and the Pb ion, mounting elements on the solder precoat thus formed, and packaging the elements on the conductive part by melting the precoat.
Une composition pour dépôt de soudrue contient un alliage de poudre de Sn-Pb et un sel de plomb d'un acide organique en guise d'éléments essentiels, et on obtient un dépôt de soudure par réaction de déplacement entre l'atome de Sn de l'alliage et l'ion Pb du sel d'acide organique. Le procédé d'encapsulation consiste à placer cette composition pour dépôt de soudure sur une partie conductrice placée sur un substrat, à former un prérevêtement de soudure sur cette partie conductrice en chauffant la composition ainsi placée pour déposer la soudure par réaction de déplacement entre l'atome de Sn et l'ion de Pb, à monter des éléments sur le prérevêtement de soudure ainsi formé, et à encapsuler ces éléments sur la partie conductrice en faisant fondre ce prérevêtement.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | SOLDER DEPOSITING COMPOSITION AND METHOD OF PACKAGING USING THE SAME |
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