POLYIMIDE RESIN LAMINATES
A thermosetting resin is comprised of (a) a bisimide, particularly a bismaleimide, (b) a polyphenol, particularly a bisphenol, and (c) dicyandiamide. The polyphenol may be styrene-terminated (i.e. a vinyl benzyl ether of a bisphenol). Flame retardance is improved by the addition of octabromodiphenyl...
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| creator | OLSON, LARRY, DALE KAMLA, JEFFREY, ROBERT |
| description | A thermosetting resin is comprised of (a) a bisimide, particularly a bismaleimide, (b) a polyphenol, particularly a bisphenol, and (c) dicyandiamide. The polyphenol may be styrene-terminated (i.e. a vinyl benzyl ether of a bisphenol). Flame retardance is improved by the addition of octabromodiphenyl oxide.
Une résine thermodurcissable se compose de (a) une bisimide, notamment un bismaléimide, (b) un polyphénol, notamment un bisphénol, et (c) un dicyandiamide. Le polyphénol peut être à terminaison de styrène (c'est-à-dire un éther de benzyle vinylique d'un bisphénol). On améliore la capacité ignifuge par l'addition d'oxyde d'octabromodiphényle). |
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Une résine thermodurcissable se compose de (a) une bisimide, notamment un bismaléimide, (b) un polyphénol, notamment un bisphénol, et (c) un dicyandiamide. Le polyphénol peut être à terminaison de styrène (c'est-à-dire un éther de benzyle vinylique d'un bisphénol). On améliore la capacité ignifuge par l'addition d'oxyde d'octabromodiphényle).</description><language>eng</language><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERAL PROCESSES OF COMPOUNDING ; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PRINTED CIRCUITS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; WORKING-UP</subject><creationdate>1991</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19910418&DB=EPODOC&CC=WO&NR=9105002A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19910418&DB=EPODOC&CC=WO&NR=9105002A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OLSON, LARRY, DALE</creatorcontrib><creatorcontrib>KAMLA, JEFFREY, ROBERT</creatorcontrib><title>POLYIMIDE RESIN LAMINATES</title><description>A thermosetting resin is comprised of (a) a bisimide, particularly a bismaleimide, (b) a polyphenol, particularly a bisphenol, and (c) dicyandiamide. The polyphenol may be styrene-terminated (i.e. a vinyl benzyl ether of a bisphenol). Flame retardance is improved by the addition of octabromodiphenyl oxide.
Une résine thermodurcissable se compose de (a) une bisimide, notamment un bismaléimide, (b) un polyphénol, notamment un bisphénol, et (c) un dicyandiamide. Le polyphénol peut être à terminaison de styrène (c'est-à-dire un éther de benzyle vinylique d'un bisphénol). On améliore la capacité ignifuge par l'addition d'oxyde d'octabromodiphényle).</description><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PRINTED CIRCUITS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1991</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAM8PeJ9PT1dHFVCHIN9vRT8HH09fRzDHEN5mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8eH-loYGpgYGRo6GxkQoAQDhEh-3</recordid><startdate>19910418</startdate><enddate>19910418</enddate><creator>OLSON, LARRY, DALE</creator><creator>KAMLA, JEFFREY, ROBERT</creator><scope>EVB</scope></search><sort><creationdate>19910418</creationdate><title>POLYIMIDE RESIN LAMINATES</title><author>OLSON, LARRY, DALE ; KAMLA, JEFFREY, ROBERT</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO9105002A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1991</creationdate><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PRINTED CIRCUITS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>OLSON, LARRY, DALE</creatorcontrib><creatorcontrib>KAMLA, JEFFREY, ROBERT</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OLSON, LARRY, DALE</au><au>KAMLA, JEFFREY, ROBERT</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>POLYIMIDE RESIN LAMINATES</title><date>1991-04-18</date><risdate>1991</risdate><abstract>A thermosetting resin is comprised of (a) a bisimide, particularly a bismaleimide, (b) a polyphenol, particularly a bisphenol, and (c) dicyandiamide. The polyphenol may be styrene-terminated (i.e. a vinyl benzyl ether of a bisphenol). Flame retardance is improved by the addition of octabromodiphenyl oxide.
Une résine thermodurcissable se compose de (a) une bisimide, notamment un bismaléimide, (b) un polyphénol, notamment un bisphénol, et (c) un dicyandiamide. Le polyphénol peut être à terminaison de styrène (c'est-à-dire un éther de benzyle vinylique d'un bisphénol). On améliore la capacité ignifuge par l'addition d'oxyde d'octabromodiphényle).</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP |
| title | POLYIMIDE RESIN LAMINATES |
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