AUTOMATIC ASSEMBLY OF INTEGRATED CIRCUITS
A system for the assembly and packaging of integrated circuits employs circuit dice that have contact pads in a standard array; a leadframe having leads configured to have the same spring constant; a method for removing selected dice from a wafer array under computer control; and a method of simulta...
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| creator | MULHOLLAND, WAYNE, A QUINN, DANIEL, J BOND, ROBERT, H OLLA, MICHAEL, A |
| description | A system for the assembly and packaging of integrated circuits employs circuit dice that have contact pads in a standard array; a leadframe having leads configured to have the same spring constant; a method for removing selected dice from a wafer array under computer control; and a method of simultaneously bonding all leads to the die.
Système pour le montage et le conditionnement de circuits intégrés utilisant des dés de circuit comportant des blocs de contact dans un réseau standard, cadre de montage comportant des conducteurs configurés de manière à avoir la même constante de ressort, procédé pour retirer des dés choisis d'un réseau de tranche sous le contrôle d'un ordinateur et procédé pour lier simultanément tous les conducteurs aux dés. |
| format | Patent |
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Système pour le montage et le conditionnement de circuits intégrés utilisant des dés de circuit comportant des blocs de contact dans un réseau standard, cadre de montage comportant des conducteurs configurés de manière à avoir la même constante de ressort, procédé pour retirer des dés choisis d'un réseau de tranche sous le contrôle d'un ordinateur et procédé pour lier simultanément tous les conducteurs aux dés.</description><edition>4</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>1985</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19851010&DB=EPODOC&CC=WO&NR=8504517A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25555,76308</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19851010&DB=EPODOC&CC=WO&NR=8504517A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MULHOLLAND, WAYNE, A</creatorcontrib><creatorcontrib>QUINN, DANIEL, J</creatorcontrib><creatorcontrib>BOND, ROBERT, H</creatorcontrib><creatorcontrib>OLLA, MICHAEL, A</creatorcontrib><title>AUTOMATIC ASSEMBLY OF INTEGRATED CIRCUITS</title><description>A system for the assembly and packaging of integrated circuits employs circuit dice that have contact pads in a standard array; a leadframe having leads configured to have the same spring constant; a method for removing selected dice from a wafer array under computer control; and a method of simultaneously bonding all leads to the die.
Système pour le montage et le conditionnement de circuits intégrés utilisant des dés de circuit comportant des blocs de contact dans un réseau standard, cadre de montage comportant des conducteurs configurés de manière à avoir la même constante de ressort, procédé pour retirer des dés choisis d'un réseau de tranche sous le contrôle d'un ordinateur et procédé pour lier simultanément tous les conducteurs aux dés.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1985</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNB0DA3x93UM8XRWcAwOdvV18olU8HdT8PQLcXUPcgxxdVFw9gxyDvUMCeZhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfHh_hamBiamhuaOhsZEKAEA-FskPw</recordid><startdate>19851010</startdate><enddate>19851010</enddate><creator>MULHOLLAND, WAYNE, A</creator><creator>QUINN, DANIEL, J</creator><creator>BOND, ROBERT, H</creator><creator>OLLA, MICHAEL, A</creator><scope>EVB</scope></search><sort><creationdate>19851010</creationdate><title>AUTOMATIC ASSEMBLY OF INTEGRATED CIRCUITS</title><author>MULHOLLAND, WAYNE, A ; QUINN, DANIEL, J ; BOND, ROBERT, H ; OLLA, MICHAEL, A</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO8504517A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1985</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>MULHOLLAND, WAYNE, A</creatorcontrib><creatorcontrib>QUINN, DANIEL, J</creatorcontrib><creatorcontrib>BOND, ROBERT, H</creatorcontrib><creatorcontrib>OLLA, MICHAEL, A</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MULHOLLAND, WAYNE, A</au><au>QUINN, DANIEL, J</au><au>BOND, ROBERT, H</au><au>OLLA, MICHAEL, A</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>AUTOMATIC ASSEMBLY OF INTEGRATED CIRCUITS</title><date>1985-10-10</date><risdate>1985</risdate><abstract>A system for the assembly and packaging of integrated circuits employs circuit dice that have contact pads in a standard array; a leadframe having leads configured to have the same spring constant; a method for removing selected dice from a wafer array under computer control; and a method of simultaneously bonding all leads to the die.
Système pour le montage et le conditionnement de circuits intégrés utilisant des dés de circuit comportant des blocs de contact dans un réseau standard, cadre de montage comportant des conducteurs configurés de manière à avoir la même constante de ressort, procédé pour retirer des dés choisis d'un réseau de tranche sous le contrôle d'un ordinateur et procédé pour lier simultanément tous les conducteurs aux dés.</abstract><edition>4</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | AUTOMATIC ASSEMBLY OF INTEGRATED CIRCUITS |
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