RETICLE DESIGN FOR MINIMIZING THERMAL STRAIN
A method for reducing thermal strain in a reticle includes determining a target operating temperature of a reticle during use of the reticle, adjusting a thermal expansion (TE) property of the reticle based on the target operating temperature of the reticle, and exposing the reticle to radiation to...
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| creator | MAKARENKO, Ksenia VAN DER SANDEN, Jacobus FINNEY, Nathan RADEMAKER, Justin VAN DE KERKHOF, Marcus DEENEN, Daniel LIPSON, Matthew MELFI, JR BAKER, Lowell |
| description | A method for reducing thermal strain in a reticle includes determining a target operating temperature of a reticle during use of the reticle, adjusting a thermal expansion (TE) property of the reticle based on the target operating temperature of the reticle, and exposing the reticle to radiation to perform a manufacturing process.
Un procédé de réduction de contrainte thermique dans un réticule consiste à déterminer une température de fonctionnement cible d'un réticule pendant l'utilisation du réticule, à ajuster une propriété d'expansion thermique (TE) du réticule sur la base de la température de fonctionnement cible du réticule, et à exposer le réticule à un rayonnement pour mettre en œuvre un processus de fabrication. |
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Un procédé de réduction de contrainte thermique dans un réticule consiste à déterminer une température de fonctionnement cible d'un réticule pendant l'utilisation du réticule, à ajuster une propriété d'expansion thermique (TE) du réticule sur la base de la température de fonctionnement cible du réticule, et à exposer le réticule à un rayonnement pour mettre en œuvre un processus de fabrication.</description><language>eng ; fre</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CINEMATOGRAPHY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241226&DB=EPODOC&CC=WO&NR=2024260733A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25547,76298</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241226&DB=EPODOC&CC=WO&NR=2024260733A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MAKARENKO, Ksenia</creatorcontrib><creatorcontrib>VAN DER SANDEN, Jacobus</creatorcontrib><creatorcontrib>FINNEY, Nathan</creatorcontrib><creatorcontrib>RADEMAKER, Justin</creatorcontrib><creatorcontrib>VAN DE KERKHOF, Marcus</creatorcontrib><creatorcontrib>DEENEN, Daniel</creatorcontrib><creatorcontrib>LIPSON, Matthew</creatorcontrib><creatorcontrib>MELFI, JR</creatorcontrib><creatorcontrib>BAKER, Lowell</creatorcontrib><title>RETICLE DESIGN FOR MINIMIZING THERMAL STRAIN</title><description>A method for reducing thermal strain in a reticle includes determining a target operating temperature of a reticle during use of the reticle, adjusting a thermal expansion (TE) property of the reticle based on the target operating temperature of the reticle, and exposing the reticle to radiation to perform a manufacturing process.
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Un procédé de réduction de contrainte thermique dans un réticule consiste à déterminer une température de fonctionnement cible d'un réticule pendant l'utilisation du réticule, à ajuster une propriété d'expansion thermique (TE) du réticule sur la base de la température de fonctionnement cible du réticule, et à exposer le réticule à un rayonnement pour mettre en œuvre un processus de fabrication.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS |
| title | RETICLE DESIGN FOR MINIMIZING THERMAL STRAIN |
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