SUBSTRATE CHUCKING ASSIST MODULE

Advanced packaging systems are disclosed for securing a substrate to a movable stage for processing. In some embodiments, a substrate pushing unit may be provided comprising a pushing assembly and linear actuator, wherein the linear actuator may lower the pushing assembly onto the substrate to apply...

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Bibliographische Detailangaben
Hauptverfasser:	CORRIVEAU, David M, PUTTASWAMY, Pavan Bommajjara, FUNG, Preston, SRIRANGARAJAN, Vasuman Ghanapaati, LEE, Cheuk Ming, JOHNSTON, Benjamin
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS
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Beschreibung
Zusammenfassung:	Advanced packaging systems are disclosed for securing a substrate to a movable stage for processing. In some embodiments, a substrate pushing unit may be provided comprising a pushing assembly and linear actuator, wherein the linear actuator may lower the pushing assembly onto the substrate to apply a downward force to flatten the substrate. L'invention concerne des systèmes d'encapsulation avancée destinés à fixer un substrat à une platine mobile en vue d'un traitement. Certains modes de réalisation peuvent comprendre une unité de poussée de substrat comprenant un ensemble de poussée et un actionneur linéaire, l'actionneur linéaire pouvant abaisser l'ensemble de poussée sur le substrat afin d'appliquer une force descendante pour aplatir le substrat.