METHOD FOR FORMING TITANIUM NITRIDE THIN FILM AND METHOD FOR FORMING ELECTRODE

A method for forming a titanium nitride thin film according to an embodiment of the present invention comprises the steps of: preparing a substrate; forming a titanium (Ti)-containing layer by spraying a precursor containing titanium (Ti) toward the substrate; and forming a titanium nitride thin fil...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	JEON, Jeong Soo, HWANG, Chul Joo, JUNG, Hyo Sub, KO, Yeo Na, OH, Tae Heon, YOO, Jin Hyuk, LEE, Da Eun
Format:	Patent
Sprache:	eng ; fre ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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