EPOXY RESIN COMPOSITION

EPOXY RESIN COMPOSITION

The present invention relates to an epoxy resin composition for molding and a vehicle part molded using same. La présente invention concerne une composition de résine époxy pour moulage et une pièce de véhicule moulée à l'aide de celle-ci. 본 발명은 몰딩용 에폭시 수지 조성물 및 이를 이용하여 몰딩된 차량용 부품에 관한 것이다....

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KIM, Eui Hyeon, PARK, Ji Seung, HWANG, Pung Koc, PARK, Chan Young
Format: Patent
Sprache:eng ; fre ; kor
Schlagworte:
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator KIM, Eui Hyeon
PARK, Ji Seung
HWANG, Pung Koc
PARK, Chan Young
description The present invention relates to an epoxy resin composition for molding and a vehicle part molded using same. La présente invention concerne une composition de résine époxy pour moulage et une pièce de véhicule moulée à l'aide de celle-ci. 본 발명은 몰딩용 에폭시 수지 조성물 및 이를 이용하여 몰딩된 차량용 부품에 관한 것이다.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_WO2024214972A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>WO2024214972A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_WO2024214972A13</originalsourceid><addsrcrecordid>eNrjZBB3DfCPiFQIcg329FNw9vcN8A_2DPH09-NhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfHh_kYGRiZGhiaW5kaOhsbEqQIAawQgmg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>EPOXY RESIN COMPOSITION</title><source>esp@cenet</source><creator>KIM, Eui Hyeon ; PARK, Ji Seung ; HWANG, Pung Koc ; PARK, Chan Young</creator><creatorcontrib>KIM, Eui Hyeon ; PARK, Ji Seung ; HWANG, Pung Koc ; PARK, Chan Young</creatorcontrib><description>The present invention relates to an epoxy resin composition for molding and a vehicle part molded using same. La présente invention concerne une composition de résine époxy pour moulage et une pièce de véhicule moulée à l'aide de celle-ci. 본 발명은 몰딩용 에폭시 수지 조성물 및 이를 이용하여 몰딩된 차량용 부품에 관한 것이다.</description><language>eng ; fre ; kor</language><subject>CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20241017&amp;DB=EPODOC&amp;CC=WO&amp;NR=2024214972A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20241017&amp;DB=EPODOC&amp;CC=WO&amp;NR=2024214972A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIM, Eui Hyeon</creatorcontrib><creatorcontrib>PARK, Ji Seung</creatorcontrib><creatorcontrib>HWANG, Pung Koc</creatorcontrib><creatorcontrib>PARK, Chan Young</creatorcontrib><title>EPOXY RESIN COMPOSITION</title><description>The present invention relates to an epoxy resin composition for molding and a vehicle part molded using same. La présente invention concerne une composition de résine époxy pour moulage et une pièce de véhicule moulée à l'aide de celle-ci. 본 발명은 몰딩용 에폭시 수지 조성물 및 이를 이용하여 몰딩된 차량용 부품에 관한 것이다.</description><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBB3DfCPiFQIcg329FNw9vcN8A_2DPH09-NhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfHh_kYGRiZGhiaW5kaOhsbEqQIAawQgmg</recordid><startdate>20241017</startdate><enddate>20241017</enddate><creator>KIM, Eui Hyeon</creator><creator>PARK, Ji Seung</creator><creator>HWANG, Pung Koc</creator><creator>PARK, Chan Young</creator><scope>EVB</scope></search><sort><creationdate>20241017</creationdate><title>EPOXY RESIN COMPOSITION</title><author>KIM, Eui Hyeon ; PARK, Ji Seung ; HWANG, Pung Koc ; PARK, Chan Young</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2024214972A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; kor</language><creationdate>2024</creationdate><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>KIM, Eui Hyeon</creatorcontrib><creatorcontrib>PARK, Ji Seung</creatorcontrib><creatorcontrib>HWANG, Pung Koc</creatorcontrib><creatorcontrib>PARK, Chan Young</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KIM, Eui Hyeon</au><au>PARK, Ji Seung</au><au>HWANG, Pung Koc</au><au>PARK, Chan Young</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>EPOXY RESIN COMPOSITION</title><date>2024-10-17</date><risdate>2024</risdate><abstract>The present invention relates to an epoxy resin composition for molding and a vehicle part molded using same. La présente invention concerne une composition de résine époxy pour moulage et une pièce de véhicule moulée à l'aide de celle-ci. 본 발명은 몰딩용 에폭시 수지 조성물 및 이를 이용하여 몰딩된 차량용 부품에 관한 것이다.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng ; fre ; kor
recordid cdi_epo_espacenet_WO2024214972A1
source esp@cenet
subjects CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
title EPOXY RESIN COMPOSITION
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-25T19%3A23%3A45IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KIM,%20Eui%20Hyeon&rft.date=2024-10-17&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EWO2024214972A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true