HEATER, TREATMENT CHAMBER, TREATMENT DEVICE AND CONTROL METHOD THEREFOR
The present application relates to a heater, a treatment chamber, a treatment device and a control method therefor. The heater comprises a heating member and a heat-conducting structure, a gas flow channel is formed in the heat-conducting structure, and the heat-conducting structure is located withi...
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| creator | SHI, Shupeng SHEN, Anlei |
| description | The present application relates to a heater, a treatment chamber, a treatment device and a control method therefor. The heater comprises a heating member and a heat-conducting structure, a gas flow channel is formed in the heat-conducting structure, and the heat-conducting structure is located within a heating range of the heating member. The heating member is used for heating gas flowing in the gas flow channel.
La présente demande concerne un dispositif de chauffage, une chambre de traitement, un dispositif de traitement et un procédé de commande associé. Le dispositif de chauffage comprend un élément chauffant et une structure thermoconductrice, un canal d'écoulement de gaz est formé dans la structure thermoconductrice, et la structure thermoconductrice est située à l'intérieur d'une plage de chauffage de l'élément chauffant. L'élément chauffant est utilisé pour chauffer un gaz s'écoulant dans le canal d'écoulement de gaz.
本申请涉及一种加热器、处理腔室、处理设备及其控制方法。加热器包括加热件和导热结构，导热结构形成有气流通道，且位于加热件的加热范围内。加热件用于加热流通于气流通道内的气体 |
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La présente demande concerne un dispositif de chauffage, une chambre de traitement, un dispositif de traitement et un procédé de commande associé. Le dispositif de chauffage comprend un élément chauffant et une structure thermoconductrice, un canal d'écoulement de gaz est formé dans la structure thermoconductrice, et la structure thermoconductrice est située à l'intérieur d'une plage de chauffage de l'élément chauffant. L'élément chauffant est utilisé pour chauffer un gaz s'écoulant dans le canal d'écoulement de gaz.
本申请涉及一种加热器、处理腔室、处理设备及其控制方法。加热器包括加热件和导热结构，导热结构形成有气流通道，且位于加热件的加热范围内。加热件用于加热流通于气流通道内的气体</description><language>chi ; eng ; fre</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241017&DB=EPODOC&CC=WO&NR=2024212828A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241017&DB=EPODOC&CC=WO&NR=2024212828A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHI, Shupeng</creatorcontrib><creatorcontrib>SHEN, Anlei</creatorcontrib><title>HEATER, TREATMENT CHAMBER, TREATMENT DEVICE AND CONTROL METHOD THEREFOR</title><description>The present application relates to a heater, a treatment chamber, a treatment device and a control method therefor. The heater comprises a heating member and a heat-conducting structure, a gas flow channel is formed in the heat-conducting structure, and the heat-conducting structure is located within a heating range of the heating member. The heating member is used for heating gas flowing in the gas flow channel.
La présente demande concerne un dispositif de chauffage, une chambre de traitement, un dispositif de traitement et un procédé de commande associé. Le dispositif de chauffage comprend un élément chauffant et une structure thermoconductrice, un canal d'écoulement de gaz est formé dans la structure thermoconductrice, et la structure thermoconductrice est située à l'intérieur d'une plage de chauffage de l'élément chauffant. L'élément chauffant est utilisé pour chauffer un gaz s'écoulant dans le canal d'écoulement de gaz.
本申请涉及一种加热器、处理腔室、处理设备及其控制方法。加热器包括加热件和导热结构，导热结构形成有气流通道，且位于加热件的加热范围内。加热件用于加热流通于气流通道内的气体</description><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHD3cHUMcQ3SUQgJAjJ8Xf1CFJw9HH2dUIVcXMM8nV0VHP1cFJz9_UKC_H0UfF1DPPxdFEI8XINc3fyDeBhY0xJzilN5oTQ3g7Kba4izh25qQX58anFBYnJqXmpJfLi_kYGRiZGhkYWRhaOhMXGqAG5FLUs</recordid><startdate>20241017</startdate><enddate>20241017</enddate><creator>SHI, Shupeng</creator><creator>SHEN, Anlei</creator><scope>EVB</scope></search><sort><creationdate>20241017</creationdate><title>HEATER, TREATMENT CHAMBER, TREATMENT DEVICE AND CONTROL METHOD THEREFOR</title><author>SHI, Shupeng ; SHEN, Anlei</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2024212828A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng ; fre</language><creationdate>2024</creationdate><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>SHI, Shupeng</creatorcontrib><creatorcontrib>SHEN, Anlei</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHI, Shupeng</au><au>SHEN, Anlei</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>HEATER, TREATMENT CHAMBER, TREATMENT DEVICE AND CONTROL METHOD THEREFOR</title><date>2024-10-17</date><risdate>2024</risdate><abstract>The present application relates to a heater, a treatment chamber, a treatment device and a control method therefor. The heater comprises a heating member and a heat-conducting structure, a gas flow channel is formed in the heat-conducting structure, and the heat-conducting structure is located within a heating range of the heating member. The heating member is used for heating gas flowing in the gas flow channel.
La présente demande concerne un dispositif de chauffage, une chambre de traitement, un dispositif de traitement et un procédé de commande associé. Le dispositif de chauffage comprend un élément chauffant et une structure thermoconductrice, un canal d'écoulement de gaz est formé dans la structure thermoconductrice, et la structure thermoconductrice est située à l'intérieur d'une plage de chauffage de l'élément chauffant. L'élément chauffant est utilisé pour chauffer un gaz s'écoulant dans le canal d'écoulement de gaz.
本申请涉及一种加热器、处理腔室、处理设备及其控制方法。加热器包括加热件和导热结构，导热结构形成有气流通道，且位于加热件的加热范围内。加热件用于加热流通于气流通道内的气体</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng ; fre |
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| subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | HEATER, TREATMENT CHAMBER, TREATMENT DEVICE AND CONTROL METHOD THEREFOR |
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