PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

A photosensitive resin composition includes (A) an acid-modified vinyl group-containing resin, (B) a photopolymerization initiator, (C) a photopolymerizable compound, and (D) a polymerization inhibitor, wherein (B) the photopolymerization initiator contains (B1) an alkylphenone photopolymerization i...

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Bibliographische Detailangaben

Hauptverfasser:	YAMAKAWA Arisa, YAMAGUCHI Kaho, SAWAMOTO Hayato, OYAMA Yasuyuki, YAMASHITA Naoki
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS
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