ADHESIVE STRUCTURE, SEMICONDUCTOR DEVICE, MOTOR, FLYING OBJECT, AND METHOD FOR MANUFACTURING ADHESIVE STRUCTURE
An adhesive structure (100) comprises a porous thin film (11) made of an epoxy resin in which pores are formed due to a porous body skeleton. The pores of the porous thin film (11) are impregnated with an adhesive (13). Due to this configuration, thermal stress is sufficiently relaxed and adhesivene...
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| creator | KAMO Yoshiyuki |
| description | An adhesive structure (100) comprises a porous thin film (11) made of an epoxy resin in which pores are formed due to a porous body skeleton. The pores of the porous thin film (11) are impregnated with an adhesive (13). Due to this configuration, thermal stress is sufficiently relaxed and adhesiveness is enhanced.
Une structure adhésive (100) comprend un film mince poreux (11) constitué d'une résine époxy dans laquelle des pores sont formés en raison d'un squelette de corps poreux. Les pores du film mince poreux (11) sont imprégnés d'un adhésif (13). Grâce à cette configuration, la contrainte thermique est suffisamment réduite et l'adhésivité est améliorée.
接着構造体（１００）は、多孔体骨格により細孔が形成されたエポキシ系樹脂製の多孔性薄膜（１１）を備え、多孔性薄膜（１１）の細孔には接着剤（１３）が含侵されている。この構成により、熱応力を十分に緩和するだけでなく、接着性にも優れる。 |
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Une structure adhésive (100) comprend un film mince poreux (11) constitué d'une résine époxy dans laquelle des pores sont formés en raison d'un squelette de corps poreux. Les pores du film mince poreux (11) sont imprégnés d'un adhésif (13). Grâce à cette configuration, la contrainte thermique est suffisamment réduite et l'adhésivité est améliorée.
接着構造体（１００）は、多孔体骨格により細孔が形成されたエポキシ系樹脂製の多孔性薄膜（１１）を備え、多孔性薄膜（１１）の細孔には接着剤（１３）が含侵されている。この構成により、熱応力を十分に緩和するだけでなく、接着性にも優れる。</description><language>eng ; fre ; jpn</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ; DYES ; DYNAMO-ELECTRIC MACHINES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERATION ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; SEMICONDUCTOR DEVICES ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241003&DB=EPODOC&CC=WO&NR=2024202009A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241003&DB=EPODOC&CC=WO&NR=2024202009A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KAMO Yoshiyuki</creatorcontrib><title>ADHESIVE STRUCTURE, SEMICONDUCTOR DEVICE, MOTOR, FLYING OBJECT, AND METHOD FOR MANUFACTURING ADHESIVE STRUCTURE</title><description>An adhesive structure (100) comprises a porous thin film (11) made of an epoxy resin in which pores are formed due to a porous body skeleton. The pores of the porous thin film (11) are impregnated with an adhesive (13). Due to this configuration, thermal stress is sufficiently relaxed and adhesiveness is enhanced.
Une structure adhésive (100) comprend un film mince poreux (11) constitué d'une résine époxy dans laquelle des pores sont formés en raison d'un squelette de corps poreux. Les pores du film mince poreux (11) sont imprégnés d'un adhésif (13). Grâce à cette configuration, la contrainte thermique est suffisamment réduite et l'adhésivité est améliorée.
接着構造体（１００）は、多孔体骨格により細孔が形成されたエポキシ系樹脂製の多孔性薄膜（１１）を備え、多孔性薄膜（１１）の細孔には接着剤（１３）が含侵されている。この構成により、熱応力を十分に緩和するだけでなく、接着性にも優れる。</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</subject><subject>DYES</subject><subject>DYNAMO-ELECTRIC MACHINES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERATION</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZMh3dPFwDfYMc1UIDgkKdQ4JDXLVUQh29fV09vdzAfL9gxRcXMM8nYGivv5Ano6Cm0-kp5-7gr-Tl6tziI6Co5-Lgq9riIe_i4IbULGvo1-omyPIHJAiTMN5GFjTEnOKU3mhNDeDsptriLOHbmpBfnxqcUFicmpeakl8uL-RgZEJEBsYWDoaGhOnCgCKAziD</recordid><startdate>20241003</startdate><enddate>20241003</enddate><creator>KAMO Yoshiyuki</creator><scope>EVB</scope></search><sort><creationdate>20241003</creationdate><title>ADHESIVE STRUCTURE, SEMICONDUCTOR DEVICE, MOTOR, FLYING OBJECT, AND METHOD FOR MANUFACTURING ADHESIVE STRUCTURE</title><author>KAMO Yoshiyuki</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2024202009A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; jpn</language><creationdate>2024</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</topic><topic>DYES</topic><topic>DYNAMO-ELECTRIC MACHINES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERATION</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>KAMO Yoshiyuki</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KAMO Yoshiyuki</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ADHESIVE STRUCTURE, SEMICONDUCTOR DEVICE, MOTOR, FLYING OBJECT, AND METHOD FOR MANUFACTURING ADHESIVE STRUCTURE</title><date>2024-10-03</date><risdate>2024</risdate><abstract>An adhesive structure (100) comprises a porous thin film (11) made of an epoxy resin in which pores are formed due to a porous body skeleton. The pores of the porous thin film (11) are impregnated with an adhesive (13). Due to this configuration, thermal stress is sufficiently relaxed and adhesiveness is enhanced.
Une structure adhésive (100) comprend un film mince poreux (11) constitué d'une résine époxy dans laquelle des pores sont formés en raison d'un squelette de corps poreux. Les pores du film mince poreux (11) sont imprégnés d'un adhésif (13). Grâce à cette configuration, la contrainte thermique est suffisamment réduite et l'adhésivité est améliorée.
接着構造体（１００）は、多孔体骨格により細孔が形成されたエポキシ系樹脂製の多孔性薄膜（１１）を備え、多孔性薄膜（１１）の細孔には接着剤（１３）が含侵されている。この構成により、熱応力を十分に緩和するだけでなく、接着性にも優れる。</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; jpn |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY CONVERSION OR DISTRIBUTION OF ELECTRIC POWER DYES DYNAMO-ELECTRIC MACHINES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES |
| title | ADHESIVE STRUCTURE, SEMICONDUCTOR DEVICE, MOTOR, FLYING OBJECT, AND METHOD FOR MANUFACTURING ADHESIVE STRUCTURE |
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