RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL CLAD LAMINATED PLATE, RESIN COMPOSITE SHEET, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE
Provided are a resin composition, a cured product, a prepreg, a metal foil clad laminated plate, a resin composite sheet, a printed wiring board, and a semiconductor device. This resin composition comprises: a resin (A) that has an indane backbone and a terminal group represented by formula (T1); a...
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| creator | MIYAMOTO Makoto FUTAMURA Keisuke |
| description | Provided are a resin composition, a cured product, a prepreg, a metal foil clad laminated plate, a resin composite sheet, a printed wiring board, and a semiconductor device. This resin composition comprises: a resin (A) that has an indane backbone and a terminal group represented by formula (T1); a polyphenylene ether compound (B) having a carbon-carbon unsaturated double bond at a terminal; and at least one selected from the group consisting of isocyanurate compounds (C1) having two or more (meth)allyl groups, glycoluril compounds (C2) having two or more (meth)allyl groups, and (meth)acrylate compounds (C3) having three or more (meth)acryloyl oxy groups.
L'invention concerne une composition de résine, un produit durci, un pré-imprégné, une plaque stratifiée revêtue de feuille métallique, une feuille composite de résine, une carte de circuit imprimé et un dispositif à semi-conducteur. La composition de résine selon l'invention comprend : une résine (A) qui a un squelette indane et un groupe terminal représenté par la formule (T1) ; un composé éther de polyphénylène (B) ayant une double liaison insaturée carbone-carbone au niveau d'une terminaison ; et au moins un composé choisi dans le groupe constitué par des composés isocyanurate (C1) ayant deux groupes (méth)allyle ou plus, des composés glycoluril (C2) ayant deux groupes (méth)allyle ou plus, et des composés (méth)acrylate (C3) ayant trois groupes (méth)acryloyloxy ou plus.
樹脂組成物、ならびに、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置の提供。式（Ｔ１）で表される末端基を有し、かつ、インダン骨格を有する樹脂（Ａ）と、末端に炭素－炭素不飽和二重結合を有するポリフェニレンエーテル化合物（Ｂ）と、（メタ）アリル基を２つ以上有するイソシアヌレート化合物（Ｃ１）、（メタ）アリル基を２つ以上有するグリコールウリル化合物（Ｃ２）、および、（メタ）アクリロイルオキシ基を３つ以上有する(メタ)アクリレート化合物（Ｃ３）からなる群より選択される少なくとも１種を含む、樹脂組成物。 |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_WO2024190725A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>WO2024190725A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_WO2024190725A13</originalsourceid><addsrcrecordid>eNqNjbEKAjEQRK-xEPUfFmwj6KmIZUzWu4UkK0n0ShGJlahw_oh_bE5s7ISBN8Vjpl-8PAZyoNjuOFAkdgLU3qOGnWe9V1HkgjmVAItRGtgyGVBGajDSkpOxc02GgN8thFAjfgbIdVZDuVSwYem1AOk0BLSk2HU_7EHjgRQOi97ldG3T6MtBMd5iVPUkPe7H1D5O53RLz2PD5bRczNbTVbmUs_l_1htI6UFB</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL CLAD LAMINATED PLATE, RESIN COMPOSITE SHEET, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE</title><source>esp@cenet</source><creator>MIYAMOTO Makoto ; FUTAMURA Keisuke</creator><creatorcontrib>MIYAMOTO Makoto ; FUTAMURA Keisuke</creatorcontrib><description>Provided are a resin composition, a cured product, a prepreg, a metal foil clad laminated plate, a resin composite sheet, a printed wiring board, and a semiconductor device. This resin composition comprises: a resin (A) that has an indane backbone and a terminal group represented by formula (T1); a polyphenylene ether compound (B) having a carbon-carbon unsaturated double bond at a terminal; and at least one selected from the group consisting of isocyanurate compounds (C1) having two or more (meth)allyl groups, glycoluril compounds (C2) having two or more (meth)allyl groups, and (meth)acrylate compounds (C3) having three or more (meth)acryloyl oxy groups.
L'invention concerne une composition de résine, un produit durci, un pré-imprégné, une plaque stratifiée revêtue de feuille métallique, une feuille composite de résine, une carte de circuit imprimé et un dispositif à semi-conducteur. La composition de résine selon l'invention comprend : une résine (A) qui a un squelette indane et un groupe terminal représenté par la formule (T1) ; un composé éther de polyphénylène (B) ayant une double liaison insaturée carbone-carbone au niveau d'une terminaison ; et au moins un composé choisi dans le groupe constitué par des composés isocyanurate (C1) ayant deux groupes (méth)allyle ou plus, des composés glycoluril (C2) ayant deux groupes (méth)allyle ou plus, et des composés (méth)acrylate (C3) ayant trois groupes (méth)acryloyloxy ou plus.
樹脂組成物、ならびに、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置の提供。式（Ｔ１）で表される末端基を有し、かつ、インダン骨格を有する樹脂（Ａ）と、末端に炭素－炭素不飽和二重結合を有するポリフェニレンエーテル化合物（Ｂ）と、（メタ）アリル基を２つ以上有するイソシアヌレート化合物（Ｃ１）、（メタ）アリル基を２つ以上有するグリコールウリル化合物（Ｃ２）、および、（メタ）アクリロイルオキシ基を３つ以上有する(メタ)アクリレート化合物（Ｃ３）からなる群より選択される少なくとも１種を含む、樹脂組成物。</description><language>eng ; fre ; jpn</language><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERAL PROCESSES OF COMPOUNDING ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING ; WORKING-UP</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240919&DB=EPODOC&CC=WO&NR=2024190725A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240919&DB=EPODOC&CC=WO&NR=2024190725A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MIYAMOTO Makoto</creatorcontrib><creatorcontrib>FUTAMURA Keisuke</creatorcontrib><title>RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL CLAD LAMINATED PLATE, RESIN COMPOSITE SHEET, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE</title><description>Provided are a resin composition, a cured product, a prepreg, a metal foil clad laminated plate, a resin composite sheet, a printed wiring board, and a semiconductor device. This resin composition comprises: a resin (A) that has an indane backbone and a terminal group represented by formula (T1); a polyphenylene ether compound (B) having a carbon-carbon unsaturated double bond at a terminal; and at least one selected from the group consisting of isocyanurate compounds (C1) having two or more (meth)allyl groups, glycoluril compounds (C2) having two or more (meth)allyl groups, and (meth)acrylate compounds (C3) having three or more (meth)acryloyl oxy groups.
L'invention concerne une composition de résine, un produit durci, un pré-imprégné, une plaque stratifiée revêtue de feuille métallique, une feuille composite de résine, une carte de circuit imprimé et un dispositif à semi-conducteur. La composition de résine selon l'invention comprend : une résine (A) qui a un squelette indane et un groupe terminal représenté par la formule (T1) ; un composé éther de polyphénylène (B) ayant une double liaison insaturée carbone-carbone au niveau d'une terminaison ; et au moins un composé choisi dans le groupe constitué par des composés isocyanurate (C1) ayant deux groupes (méth)allyle ou plus, des composés glycoluril (C2) ayant deux groupes (méth)allyle ou plus, et des composés (méth)acrylate (C3) ayant trois groupes (méth)acryloyloxy ou plus.
樹脂組成物、ならびに、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置の提供。式（Ｔ１）で表される末端基を有し、かつ、インダン骨格を有する樹脂（Ａ）と、末端に炭素－炭素不飽和二重結合を有するポリフェニレンエーテル化合物（Ｂ）と、（メタ）アリル基を２つ以上有するイソシアヌレート化合物（Ｃ１）、（メタ）アリル基を２つ以上有するグリコールウリル化合物（Ｃ２）、および、（メタ）アクリロイルオキシ基を３つ以上有する(メタ)アクリレート化合物（Ｃ３）からなる群より選択される少なくとも１種を含む、樹脂組成物。</description><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>TRANSPORTING</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjbEKAjEQRK-xEPUfFmwj6KmIZUzWu4UkK0n0ShGJlahw_oh_bE5s7ISBN8Vjpl-8PAZyoNjuOFAkdgLU3qOGnWe9V1HkgjmVAItRGtgyGVBGajDSkpOxc02GgN8thFAjfgbIdVZDuVSwYem1AOk0BLSk2HU_7EHjgRQOi97ldG3T6MtBMd5iVPUkPe7H1D5O53RLz2PD5bRczNbTVbmUs_l_1htI6UFB</recordid><startdate>20240919</startdate><enddate>20240919</enddate><creator>MIYAMOTO Makoto</creator><creator>FUTAMURA Keisuke</creator><scope>EVB</scope></search><sort><creationdate>20240919</creationdate><title>RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL CLAD LAMINATED PLATE, RESIN COMPOSITE SHEET, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE</title><author>MIYAMOTO Makoto ; FUTAMURA Keisuke</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2024190725A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; jpn</language><creationdate>2024</creationdate><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>TRANSPORTING</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>MIYAMOTO Makoto</creatorcontrib><creatorcontrib>FUTAMURA Keisuke</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MIYAMOTO Makoto</au><au>FUTAMURA Keisuke</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL CLAD LAMINATED PLATE, RESIN COMPOSITE SHEET, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE</title><date>2024-09-19</date><risdate>2024</risdate><abstract>Provided are a resin composition, a cured product, a prepreg, a metal foil clad laminated plate, a resin composite sheet, a printed wiring board, and a semiconductor device. This resin composition comprises: a resin (A) that has an indane backbone and a terminal group represented by formula (T1); a polyphenylene ether compound (B) having a carbon-carbon unsaturated double bond at a terminal; and at least one selected from the group consisting of isocyanurate compounds (C1) having two or more (meth)allyl groups, glycoluril compounds (C2) having two or more (meth)allyl groups, and (meth)acrylate compounds (C3) having three or more (meth)acryloyl oxy groups.
L'invention concerne une composition de résine, un produit durci, un pré-imprégné, une plaque stratifiée revêtue de feuille métallique, une feuille composite de résine, une carte de circuit imprimé et un dispositif à semi-conducteur. La composition de résine selon l'invention comprend : une résine (A) qui a un squelette indane et un groupe terminal représenté par la formule (T1) ; un composé éther de polyphénylène (B) ayant une double liaison insaturée carbone-carbone au niveau d'une terminaison ; et au moins un composé choisi dans le groupe constitué par des composés isocyanurate (C1) ayant deux groupes (méth)allyle ou plus, des composés glycoluril (C2) ayant deux groupes (méth)allyle ou plus, et des composés (méth)acrylate (C3) ayant trois groupes (méth)acryloyloxy ou plus.
樹脂組成物、ならびに、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置の提供。式（Ｔ１）で表される末端基を有し、かつ、インダン骨格を有する樹脂（Ａ）と、末端に炭素－炭素不飽和二重結合を有するポリフェニレンエーテル化合物（Ｂ）と、（メタ）アリル基を２つ以上有するイソシアヌレート化合物（Ｃ１）、（メタ）アリル基を２つ以上有するグリコールウリル化合物（Ｃ２）、および、（メタ）アクリロイルオキシ基を３つ以上有する(メタ)アクリレート化合物（Ｃ３）からなる群より選択される少なくとも１種を含む、樹脂組成物。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP |
| title | RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL CLAD LAMINATED PLATE, RESIN COMPOSITE SHEET, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE |
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