MULTI-CHAMBERED CHEMICAL SOLID PRECURSOR AMPOULE
A multi-chamber ampoule having a multi-chamber container and a lid is disclosed. The lid includes conduits for fluidly connecting multiple chambers of the container. The sublimation rate of each chamber is defined by a surface area of each chamber, a temperature of each chamber, and a headspace pres...
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| creator | ESCHBACH, Robert BIRTCHER, Charles M |
| description | A multi-chamber ampoule having a multi-chamber container and a lid is disclosed. The lid includes conduits for fluidly connecting multiple chambers of the container. The sublimation rate of each chamber is defined by a surface area of each chamber, a temperature of each chamber, and a headspace pressure of each chamber, and the sublimation rate of each chamber is substantially equal.
L'invention concerne également une ampoule à chambres multiples ayant un récipient à chambres multiples et un couvercle. Le couvercle comprend des conduits pour relier de manière fluidique de multiples chambres du récipient. Le taux de sublimation de chaque chambre est défini par une zone de surface de chaque chambre, une température de chaque chambre, et une pression d'espace de tête de chaque chambre, et le taux de sublimation de chaque chambre est sensiblement égal. |
| format | Patent |
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L'invention concerne également une ampoule à chambres multiples ayant un récipient à chambres multiples et un couvercle. Le couvercle comprend des conduits pour relier de manière fluidique de multiples chambres du récipient. Le taux de sublimation de chaque chambre est défini par une zone de surface de chaque chambre, une température de chaque chambre, et une pression d'espace de tête de chaque chambre, et le taux de sublimation de chaque chambre est sensiblement égal.</description><language>eng ; fre</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SEMICONDUCTOR DEVICES ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240912&DB=EPODOC&CC=WO&NR=2024186726A2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240912&DB=EPODOC&CC=WO&NR=2024186726A2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ESCHBACH, Robert</creatorcontrib><creatorcontrib>BIRTCHER, Charles M</creatorcontrib><title>MULTI-CHAMBERED CHEMICAL SOLID PRECURSOR AMPOULE</title><description>A multi-chamber ampoule having a multi-chamber container and a lid is disclosed. The lid includes conduits for fluidly connecting multiple chambers of the container. The sublimation rate of each chamber is defined by a surface area of each chamber, a temperature of each chamber, and a headspace pressure of each chamber, and the sublimation rate of each chamber is substantially equal.
L'invention concerne également une ampoule à chambres multiples ayant un récipient à chambres multiples et un couvercle. Le couvercle comprend des conduits pour relier de manière fluidique de multiples chambres du récipient. Le taux de sublimation de chaque chambre est défini par une zone de surface de chaque chambre, une température de chaque chambre, et une pression d'espace de tête de chaque chambre, et le taux de sublimation de chaque chambre est sensiblement égal.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDDwDfUJ8dR19nD0dXINcnVRcPZw9fV0dvRRCPb38XRRCAhydQ4NCvYPUnD0DfAP9XHlYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx4f5GBkYmhhZm5kZmjkbGxKkCAMwgJ1E</recordid><startdate>20240912</startdate><enddate>20240912</enddate><creator>ESCHBACH, Robert</creator><creator>BIRTCHER, Charles M</creator><scope>EVB</scope></search><sort><creationdate>20240912</creationdate><title>MULTI-CHAMBERED CHEMICAL SOLID PRECURSOR AMPOULE</title><author>ESCHBACH, Robert ; BIRTCHER, Charles M</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2024186726A23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>ESCHBACH, Robert</creatorcontrib><creatorcontrib>BIRTCHER, Charles M</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ESCHBACH, Robert</au><au>BIRTCHER, Charles M</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MULTI-CHAMBERED CHEMICAL SOLID PRECURSOR AMPOULE</title><date>2024-09-12</date><risdate>2024</risdate><abstract>A multi-chamber ampoule having a multi-chamber container and a lid is disclosed. The lid includes conduits for fluidly connecting multiple chambers of the container. The sublimation rate of each chamber is defined by a surface area of each chamber, a temperature of each chamber, and a headspace pressure of each chamber, and the sublimation rate of each chamber is substantially equal.
L'invention concerne également une ampoule à chambres multiples ayant un récipient à chambres multiples et un couvercle. Le couvercle comprend des conduits pour relier de manière fluidique de multiples chambres du récipient. Le taux de sublimation de chaque chambre est défini par une zone de surface de chaque chambre, une température de chaque chambre, et une pression d'espace de tête de chaque chambre, et le taux de sublimation de chaque chambre est sensiblement égal.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | MULTI-CHAMBERED CHEMICAL SOLID PRECURSOR AMPOULE |
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