POWER ELECTRONICS MODULE WITH INTEGRATED CERAMIC HEAT EXCHANGER
A cooling device for at least one power electronics module that may serve as both an electrical insulator and a heat exchanger with integrated and thermally optimized surface enhancement features and cooling channels is described. The cooling device may replace the traditional baseplate sandwiched b...
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| creator | PARET, Paul Philip FARIAS, Stephen Louis MORENO, Gilberto PETERS, Adam Bryan DEVOTO, Douglas John MAJOR, Joshua John NARUMANCHI, Sreekant Venkat Jagannath |
| description | A cooling device for at least one power electronics module that may serve as both an electrical insulator and a heat exchanger with integrated and thermally optimized surface enhancement features and cooling channels is described. The cooling device may replace the traditional baseplate sandwiched between layers of copper traditionally used to cool power electronics systems. Additionally, the cooling device may act as both a heat exchanger and take the role of the traditional metallization layer.
L'invention concerne un dispositif de refroidissement pour au moins un module électronique de puissance qui peut servir à la fois d'isolant électrique et d'échangeur de chaleur avec des éléments d'amélioration de surface et des canaux de refroidissement intégrés et thermiquement optimisés. Le dispositif de refroidissement peut remplacer la plaque de base classique prise en sandwich entre des couches de cuivre traditionnellement utilisées pour refroidir des systèmes électroniques de puissance. De plus, le dispositif de refroidissement peut agir à la fois en tant qu'échangeur de chaleur et prendre le rôle de la couche de métallisation classique. |
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L'invention concerne un dispositif de refroidissement pour au moins un module électronique de puissance qui peut servir à la fois d'isolant électrique et d'échangeur de chaleur avec des éléments d'amélioration de surface et des canaux de refroidissement intégrés et thermiquement optimisés. Le dispositif de refroidissement peut remplacer la plaque de base classique prise en sandwich entre des couches de cuivre traditionnellement utilisées pour refroidir des systèmes électroniques de puissance. De plus, le dispositif de refroidissement peut agir à la fois en tant qu'échangeur de chaleur et prendre le rôle de la couche de métallisation classique.</description><language>eng ; fre</language><subject>BASIC ELECTRIC ELEMENTS ; BLASTING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HEAT EXCHANGE IN GENERAL ; HEATING ; LIGHTING ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MECHANICAL ENGINEERING ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; WEAPONS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240808&DB=EPODOC&CC=WO&NR=2024163848A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240808&DB=EPODOC&CC=WO&NR=2024163848A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>PARET, Paul Philip</creatorcontrib><creatorcontrib>FARIAS, Stephen Louis</creatorcontrib><creatorcontrib>MORENO, Gilberto</creatorcontrib><creatorcontrib>PETERS, Adam Bryan</creatorcontrib><creatorcontrib>DEVOTO, Douglas John</creatorcontrib><creatorcontrib>MAJOR, Joshua John</creatorcontrib><creatorcontrib>NARUMANCHI, Sreekant Venkat Jagannath</creatorcontrib><title>POWER ELECTRONICS MODULE WITH INTEGRATED CERAMIC HEAT EXCHANGER</title><description>A cooling device for at least one power electronics module that may serve as both an electrical insulator and a heat exchanger with integrated and thermally optimized surface enhancement features and cooling channels is described. The cooling device may replace the traditional baseplate sandwiched between layers of copper traditionally used to cool power electronics systems. Additionally, the cooling device may act as both a heat exchanger and take the role of the traditional metallization layer.
L'invention concerne un dispositif de refroidissement pour au moins un module électronique de puissance qui peut servir à la fois d'isolant électrique et d'échangeur de chaleur avec des éléments d'amélioration de surface et des canaux de refroidissement intégrés et thermiquement optimisés. Le dispositif de refroidissement peut remplacer la plaque de base classique prise en sandwich entre des couches de cuivre traditionnellement utilisées pour refroidir des systèmes électroniques de puissance. De plus, le dispositif de refroidissement peut agir à la fois en tant qu'échangeur de chaleur et prendre le rôle de la couche de métallisation classique.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BLASTING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HEAT EXCHANGE IN GENERAL</subject><subject>HEATING</subject><subject>LIGHTING</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MECHANICAL ENGINEERING</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAP8A93DVJw9XF1Dgny9_N0Dlbw9XcJ9XFVCPcM8VDw9AtxdQ9yDHF1UXB2DXL09XRW8HB1DFFwjXD2cPRzdw3iYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx4f5GBkYmhmbGFiYWjobGxKkCADU1K14</recordid><startdate>20240808</startdate><enddate>20240808</enddate><creator>PARET, Paul Philip</creator><creator>FARIAS, Stephen Louis</creator><creator>MORENO, Gilberto</creator><creator>PETERS, Adam Bryan</creator><creator>DEVOTO, Douglas John</creator><creator>MAJOR, Joshua John</creator><creator>NARUMANCHI, Sreekant Venkat Jagannath</creator><scope>EVB</scope></search><sort><creationdate>20240808</creationdate><title>POWER ELECTRONICS MODULE WITH INTEGRATED CERAMIC HEAT EXCHANGER</title><author>PARET, Paul Philip ; FARIAS, Stephen Louis ; MORENO, Gilberto ; PETERS, Adam Bryan ; DEVOTO, Douglas John ; MAJOR, Joshua John ; NARUMANCHI, Sreekant Venkat Jagannath</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2024163848A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BLASTING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HEAT EXCHANGE IN GENERAL</topic><topic>HEATING</topic><topic>LIGHTING</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MECHANICAL ENGINEERING</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>PARET, Paul Philip</creatorcontrib><creatorcontrib>FARIAS, Stephen Louis</creatorcontrib><creatorcontrib>MORENO, Gilberto</creatorcontrib><creatorcontrib>PETERS, Adam Bryan</creatorcontrib><creatorcontrib>DEVOTO, Douglas John</creatorcontrib><creatorcontrib>MAJOR, Joshua John</creatorcontrib><creatorcontrib>NARUMANCHI, Sreekant Venkat Jagannath</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>PARET, Paul Philip</au><au>FARIAS, Stephen Louis</au><au>MORENO, Gilberto</au><au>PETERS, Adam Bryan</au><au>DEVOTO, Douglas John</au><au>MAJOR, Joshua John</au><au>NARUMANCHI, Sreekant Venkat Jagannath</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>POWER ELECTRONICS MODULE WITH INTEGRATED CERAMIC HEAT EXCHANGER</title><date>2024-08-08</date><risdate>2024</risdate><abstract>A cooling device for at least one power electronics module that may serve as both an electrical insulator and a heat exchanger with integrated and thermally optimized surface enhancement features and cooling channels is described. The cooling device may replace the traditional baseplate sandwiched between layers of copper traditionally used to cool power electronics systems. Additionally, the cooling device may act as both a heat exchanger and take the role of the traditional metallization layer.
L'invention concerne un dispositif de refroidissement pour au moins un module électronique de puissance qui peut servir à la fois d'isolant électrique et d'échangeur de chaleur avec des éléments d'amélioration de surface et des canaux de refroidissement intégrés et thermiquement optimisés. Le dispositif de refroidissement peut remplacer la plaque de base classique prise en sandwich entre des couches de cuivre traditionnellement utilisées pour refroidir des systèmes électroniques de puissance. De plus, le dispositif de refroidissement peut agir à la fois en tant qu'échangeur de chaleur et prendre le rôle de la couche de métallisation classique.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS SEMICONDUCTOR DEVICES WEAPONS |
| title | POWER ELECTRONICS MODULE WITH INTEGRATED CERAMIC HEAT EXCHANGER |
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