CHIP-TO-SHEET DIRECT HYBRID BONDING METHOD

The invention relates to a method for the direct hybrid bonding of chip (10) to sheet (20), comprising the following steps: Providing at least one chip (10) comprising a first copper pad (11) and a first layer (12) of silicon oxide, Providing a sheet (20) comprising a second copper pad (21) and a se...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SARCIAT, Antoine, FOURNEL, Frank, SANCHEZ, Loic, NADI, Noura, RAYNAUD, Nicolas, CASTAN, Clément, KERBIRIOU, Tifenn
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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