TEMPERATURE CONTROL SYSTEM, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, PROCESSING DEVICE, AND PROGRAM
Provided is technology that makes it possible to switch between a plurality of temperature sensors and perform temperature control. The present invention comprises a first control mode that controls the temperature in a processing chamber on the basis of the temperature detected by a first temperatu...
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| creator | NAKANISHI Kento YAMAGUCHI Hideto SHIGEMATSU Seiya |
| description | Provided is technology that makes it possible to switch between a plurality of temperature sensors and perform temperature control. The present invention comprises a first control mode that controls the temperature in a processing chamber on the basis of the temperature detected by a first temperature sensor positioned at a heating portion, a second control mode that controls the temperature in the processing chamber on the basis of the temperature detected by a second temperature sensor provided to a holding tool for holding a substrate, and a switching unit that is configured to be capable of switching between the first control mode and the second control mode so that temperature control is executed in accordance with a state of the holding tool.
L'invention concerne une technologie qui permet de commuter entre une pluralité de capteurs de température et de mettre en oeuvre une commande de température. La présente invention comprend un premier mode de commande, qui commande la température dans une chambre de traitement sur la base de la température détectée par un premier capteur de température positionné au niveau d'une partie de chauffage ; un second mode de commande, qui commande la température dans la chambre de traitement sur la base de la température détectée par un second capteur de température se situant sur un outil de maintien pour maintenir un substrat ; et une unité de commutation qui est configurée pour pouvoir commuter entre le premier mode de commande et le second mode de commande afin que la commande de température soit exécutée conformément à un état de l'outil de maintien.
複数の温度センサを切り替えて温度制御することができる技術を提供する。加熱部に配置される第１温度センサの検出温度に基づいて処理室の温度を制御する第１制御モードと、基板を保持する保持具に設けられる第２温度センサの検出温度に基づいて処理室の温度を制御する第２制御モードと、保持具の状態に応じて温度制御を実行させるように、第１制御モードと第２制御モードの切り替えを行うことが可能に構成されている切替部と、を有する。 |
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L'invention concerne une technologie qui permet de commuter entre une pluralité de capteurs de température et de mettre en oeuvre une commande de température. La présente invention comprend un premier mode de commande, qui commande la température dans une chambre de traitement sur la base de la température détectée par un premier capteur de température positionné au niveau d'une partie de chauffage ; un second mode de commande, qui commande la température dans la chambre de traitement sur la base de la température détectée par un second capteur de température se situant sur un outil de maintien pour maintenir un substrat ; et une unité de commutation qui est configurée pour pouvoir commuter entre le premier mode de commande et le second mode de commande afin que la commande de température soit exécutée conformément à un état de l'outil de maintien.
複数の温度センサを切り替えて温度制御することができる技術を提供する。加熱部に配置される第１温度センサの検出温度に基づいて処理室の温度を制御する第１制御モードと、基板を保持する保持具に設けられる第２温度センサの検出温度に基づいて処理室の温度を制御する第２制御モードと、保持具の状態に応じて温度制御を実行させるように、第１制御モードと第２制御モードの切り替えを行うことが可能に構成されている切替部と、を有する。</description><language>eng ; fre ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SEMICONDUCTOR DEVICES ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240627&DB=EPODOC&CC=WO&NR=2024135039A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240627&DB=EPODOC&CC=WO&NR=2024135039A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NAKANISHI Kento</creatorcontrib><creatorcontrib>YAMAGUCHI Hideto</creatorcontrib><creatorcontrib>SHIGEMATSU Seiya</creatorcontrib><title>TEMPERATURE CONTROL SYSTEM, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, PROCESSING DEVICE, AND PROGRAM</title><description>Provided is technology that makes it possible to switch between a plurality of temperature sensors and perform temperature control. The present invention comprises a first control mode that controls the temperature in a processing chamber on the basis of the temperature detected by a first temperature sensor positioned at a heating portion, a second control mode that controls the temperature in the processing chamber on the basis of the temperature detected by a second temperature sensor provided to a holding tool for holding a substrate, and a switching unit that is configured to be capable of switching between the first control mode and the second control mode so that temperature control is executed in accordance with a state of the holding tool.
L'invention concerne une technologie qui permet de commuter entre une pluralité de capteurs de température et de mettre en oeuvre une commande de température. La présente invention comprend un premier mode de commande, qui commande la température dans une chambre de traitement sur la base de la température détectée par un premier capteur de température positionné au niveau d'une partie de chauffage ; un second mode de commande, qui commande la température dans la chambre de traitement sur la base de la température détectée par un second capteur de température se situant sur un outil de maintien pour maintenir un substrat ; et une unité de commutation qui est configurée pour pouvoir commuter entre le premier mode de commande et le second mode de commande afin que la commande de température soit exécutée conformément à un état de l'outil de maintien.
複数の温度センサを切り替えて温度制御することができる技術を提供する。加熱部に配置される第１温度センサの検出温度に基づいて処理室の温度を制御する第１制御モードと、基板を保持する保持具に設けられる第２温度センサの検出温度に基づいて処理室の温度を制御する第２制御モードと、保持具の状態に応じて温度制御を実行させるように、第１制御モードと第２制御モードの切り替えを行うことが可能に構成されている切替部と、を有する。</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyr0KwjAYheEuDqLewweuFdrGDo4h-dIGTFLyoziVIhEE0UK9f0xBd6cD73mW2d2j6tBSHywCM9pbcwR3cSnnoNC3hoMwFhTVQVCWmNQNOFQyYR6YTx_Hk2SYQ2cNQ-dm8EtU8zk3lqp1trgNjyluvrvKtgI9a3dxfPVxGodrfMZ3fzZVUe1LUhfkQEvyn_oAbiQ3FQ</recordid><startdate>20240627</startdate><enddate>20240627</enddate><creator>NAKANISHI Kento</creator><creator>YAMAGUCHI Hideto</creator><creator>SHIGEMATSU Seiya</creator><scope>EVB</scope></search><sort><creationdate>20240627</creationdate><title>TEMPERATURE CONTROL SYSTEM, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, PROCESSING DEVICE, AND PROGRAM</title><author>NAKANISHI Kento ; YAMAGUCHI Hideto ; SHIGEMATSU Seiya</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2024135039A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; jpn</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>NAKANISHI Kento</creatorcontrib><creatorcontrib>YAMAGUCHI Hideto</creatorcontrib><creatorcontrib>SHIGEMATSU Seiya</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NAKANISHI Kento</au><au>YAMAGUCHI Hideto</au><au>SHIGEMATSU Seiya</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>TEMPERATURE CONTROL SYSTEM, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, PROCESSING DEVICE, AND PROGRAM</title><date>2024-06-27</date><risdate>2024</risdate><abstract>Provided is technology that makes it possible to switch between a plurality of temperature sensors and perform temperature control. The present invention comprises a first control mode that controls the temperature in a processing chamber on the basis of the temperature detected by a first temperature sensor positioned at a heating portion, a second control mode that controls the temperature in the processing chamber on the basis of the temperature detected by a second temperature sensor provided to a holding tool for holding a substrate, and a switching unit that is configured to be capable of switching between the first control mode and the second control mode so that temperature control is executed in accordance with a state of the holding tool.
L'invention concerne une technologie qui permet de commuter entre une pluralité de capteurs de température et de mettre en oeuvre une commande de température. La présente invention comprend un premier mode de commande, qui commande la température dans une chambre de traitement sur la base de la température détectée par un premier capteur de température positionné au niveau d'une partie de chauffage ; un second mode de commande, qui commande la température dans la chambre de traitement sur la base de la température détectée par un second capteur de température se situant sur un outil de maintien pour maintenir un substrat ; et une unité de commutation qui est configurée pour pouvoir commuter entre le premier mode de commande et le second mode de commande afin que la commande de température soit exécutée conformément à un état de l'outil de maintien.
複数の温度センサを切り替えて温度制御することができる技術を提供する。加熱部に配置される第１温度センサの検出温度に基づいて処理室の温度を制御する第１制御モードと、基板を保持する保持具に設けられる第２温度センサの検出温度に基づいて処理室の温度を制御する第２制御モードと、保持具の状態に応じて温度制御を実行させるように、第１制御モードと第２制御モードの切り替えを行うことが可能に構成されている切替部と、を有する。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | TEMPERATURE CONTROL SYSTEM, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, PROCESSING DEVICE, AND PROGRAM |
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