RESIN, RESIN COMPOSITION, AND USE THEREOF
The present invention provides a resin. The present invention also provides a resin production method, a resin composition using said resin, a cured product, a prepreg, a metal foil-clad laminate, a resin composite sheet, a printed wiring board, and a semiconductor device. The resin is represented b...
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| creator | MIYAMOTO Makoto FUTAMURA Keisuke |
| description | The present invention provides a resin. The present invention also provides a resin production method, a resin composition using said resin, a cured product, a prepreg, a metal foil-clad laminate, a resin composite sheet, a printed wiring board, and a semiconductor device. The resin is represented by formula (T). In formula (T), R is a group including a structural unit represented by formula (Tx).
L'invention fournit une résine. En outre, l'invention fournit un procédé de fabrication de cette résine, une composition de résine mettant en œuvre cette résine, un objet durci, un préimprégné, une plaque stratifiée plaquée de feuille métallique, une feuille composite de résine, une carte de circuit imprimé et un dispositif à semi-conducteurs. La résine de l'invention est représentée par la formule (T). Dans la formule (T), R représente un groupe contenant une unité structurale représentée par (Tx).
樹脂の提供。樹脂の製造方法、樹脂を用いた樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置の提供。式（Ｔ）で表される、樹脂。式（Ｔ）中、Ｒは、式（Ｔｘ）で表される構成単位を含む基である。 |
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L'invention fournit une résine. En outre, l'invention fournit un procédé de fabrication de cette résine, une composition de résine mettant en œuvre cette résine, un objet durci, un préimprégné, une plaque stratifiée plaquée de feuille métallique, une feuille composite de résine, une carte de circuit imprimé et un dispositif à semi-conducteurs. La résine de l'invention est représentée par la formule (T). Dans la formule (T), R représente un groupe contenant une unité structurale représentée par (Tx).
樹脂の提供。樹脂の製造方法、樹脂を用いた樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置の提供。式（Ｔ）で表される、樹脂。式（Ｔ）中、Ｒは、式（Ｔｘ）で表される構成単位を含む基である。</description><language>eng ; fre ; jpn</language><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERAL PROCESSES OF COMPOUNDING ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING ; WORKING-UP</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240516&DB=EPODOC&CC=WO&NR=2024101238A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240516&DB=EPODOC&CC=WO&NR=2024101238A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MIYAMOTO Makoto</creatorcontrib><creatorcontrib>FUTAMURA Keisuke</creatorcontrib><title>RESIN, RESIN COMPOSITION, AND USE THEREOF</title><description>The present invention provides a resin. The present invention also provides a resin production method, a resin composition using said resin, a cured product, a prepreg, a metal foil-clad laminate, a resin composite sheet, a printed wiring board, and a semiconductor device. The resin is represented by formula (T). In formula (T), R is a group including a structural unit represented by formula (Tx).
L'invention fournit une résine. En outre, l'invention fournit un procédé de fabrication de cette résine, une composition de résine mettant en œuvre cette résine, un objet durci, un préimprégné, une plaque stratifiée plaquée de feuille métallique, une feuille composite de résine, une carte de circuit imprimé et un dispositif à semi-conducteurs. La résine de l'invention est représentée par la formule (T). Dans la formule (T), R représente un groupe contenant une unité structurale représentée par (Tx).
樹脂の提供。樹脂の製造方法、樹脂を用いた樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置の提供。式（Ｔ）で表される、樹脂。式（Ｔ）中、Ｒは、式（Ｔｘ）で表される構成単位を含む基である。</description><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>TRANSPORTING</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAMcg329NNRAFMKzv6-Af7BniGe_kAhRz8XhdBgV4UQD9cgV383HgbWtMSc4lReKM3NoOzmGuLsoZtakB-fWlyQmJyal1oSH-5vZGBkYmhgaGRs4WhoTJwqAKg0JQk</recordid><startdate>20240516</startdate><enddate>20240516</enddate><creator>MIYAMOTO Makoto</creator><creator>FUTAMURA Keisuke</creator><scope>EVB</scope></search><sort><creationdate>20240516</creationdate><title>RESIN, RESIN COMPOSITION, AND USE THEREOF</title><author>MIYAMOTO Makoto ; FUTAMURA Keisuke</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2024101238A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; jpn</language><creationdate>2024</creationdate><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>TRANSPORTING</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>MIYAMOTO Makoto</creatorcontrib><creatorcontrib>FUTAMURA Keisuke</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MIYAMOTO Makoto</au><au>FUTAMURA Keisuke</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>RESIN, RESIN COMPOSITION, AND USE THEREOF</title><date>2024-05-16</date><risdate>2024</risdate><abstract>The present invention provides a resin. The present invention also provides a resin production method, a resin composition using said resin, a cured product, a prepreg, a metal foil-clad laminate, a resin composite sheet, a printed wiring board, and a semiconductor device. The resin is represented by formula (T). In formula (T), R is a group including a structural unit represented by formula (Tx).
L'invention fournit une résine. En outre, l'invention fournit un procédé de fabrication de cette résine, une composition de résine mettant en œuvre cette résine, un objet durci, un préimprégné, une plaque stratifiée plaquée de feuille métallique, une feuille composite de résine, une carte de circuit imprimé et un dispositif à semi-conducteurs. La résine de l'invention est représentée par la formule (T). Dans la formule (T), R représente un groupe contenant une unité structurale représentée par (Tx).
樹脂の提供。樹脂の製造方法、樹脂を用いた樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置の提供。式（Ｔ）で表される、樹脂。式（Ｔ）中、Ｒは、式（Ｔｘ）で表される構成単位を含む基である。</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; jpn |
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| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP |
| title | RESIN, RESIN COMPOSITION, AND USE THEREOF |
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