RESIN, RESIN COMPOSITION, AND USE THEREOF
This resin has a structural unit derived from a compound represented by formula (DIP) as a main component thereof, and has a structure represented by formula (In-1) and/or formula (In-2). The present invention also provides a resin production method, a resin composition using said resin, a cured pro...
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| creator | MIYAMOTO Makoto FUTAMURA Keisuke |
| description | This resin has a structural unit derived from a compound represented by formula (DIP) as a main component thereof, and has a structure represented by formula (In-1) and/or formula (In-2). The present invention also provides a resin production method, a resin composition using said resin, a cured product, a prepreg, a metal foil-clad laminate, a resin composite sheet, a printed wiring board, and a semiconductor device.
L'invention concerne une résine ayant pour principal composant une unité structurale dérivée d'un composé représenté par la formule (DIP), et possédant une structure représentée par la formule （Ｉｎ－１） et/ou la formule （Ｉｎ－２）. En outre, l'invention fournit un procédé de fabrication de cette résine, une composition de résine mettant en œuvre cette résine, un objet durci, un préimprégné, une plaque stratifiée plaquée de feuille métallique, une feuille composite de résine, une carte de circuit imprimé et un dispositif à semi-conducteurs.
式（ＤＩＰ）で表される化合物由来の構成単位を主成分とし、かつ、式（Ｉｎ－１）および／または式（Ｉｎ－２）で表される構造を有する樹脂。樹脂の製造方法、樹脂を用いた樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置の提供。 |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_WO2024101237A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>WO2024101237A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_WO2024101237A13</originalsourceid><addsrcrecordid>eNrjZNAMcg329NNRAFMKzv6-Af7BniGe_kAhRz8XhdBgV4UQD9cgV383HgbWtMSc4lReKM3NoOzmGuLsoZtakB-fWlyQmJyal1oSH-5vZGBkYmhgaGRs7mhoTJwqAKgGJQc</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>RESIN, RESIN COMPOSITION, AND USE THEREOF</title><source>esp@cenet</source><creator>MIYAMOTO Makoto ; FUTAMURA Keisuke</creator><creatorcontrib>MIYAMOTO Makoto ; FUTAMURA Keisuke</creatorcontrib><description>This resin has a structural unit derived from a compound represented by formula (DIP) as a main component thereof, and has a structure represented by formula (In-1) and/or formula (In-2). The present invention also provides a resin production method, a resin composition using said resin, a cured product, a prepreg, a metal foil-clad laminate, a resin composite sheet, a printed wiring board, and a semiconductor device.
L'invention concerne une résine ayant pour principal composant une unité structurale dérivée d'un composé représenté par la formule (DIP), et possédant une structure représentée par la formule （Ｉｎ－１） et/ou la formule （Ｉｎ－２）. En outre, l'invention fournit un procédé de fabrication de cette résine, une composition de résine mettant en œuvre cette résine, un objet durci, un préimprégné, une plaque stratifiée plaquée de feuille métallique, une feuille composite de résine, une carte de circuit imprimé et un dispositif à semi-conducteurs.
式（ＤＩＰ）で表される化合物由来の構成単位を主成分とし、かつ、式（Ｉｎ－１）および／または式（Ｉｎ－２）で表される構造を有する樹脂。樹脂の製造方法、樹脂を用いた樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置の提供。</description><language>eng ; fre ; jpn</language><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERAL PROCESSES OF COMPOUNDING ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING ; WORKING-UP</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240516&DB=EPODOC&CC=WO&NR=2024101237A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240516&DB=EPODOC&CC=WO&NR=2024101237A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MIYAMOTO Makoto</creatorcontrib><creatorcontrib>FUTAMURA Keisuke</creatorcontrib><title>RESIN, RESIN COMPOSITION, AND USE THEREOF</title><description>This resin has a structural unit derived from a compound represented by formula (DIP) as a main component thereof, and has a structure represented by formula (In-1) and/or formula (In-2). The present invention also provides a resin production method, a resin composition using said resin, a cured product, a prepreg, a metal foil-clad laminate, a resin composite sheet, a printed wiring board, and a semiconductor device.
L'invention concerne une résine ayant pour principal composant une unité structurale dérivée d'un composé représenté par la formule (DIP), et possédant une structure représentée par la formule （Ｉｎ－１） et/ou la formule （Ｉｎ－２）. En outre, l'invention fournit un procédé de fabrication de cette résine, une composition de résine mettant en œuvre cette résine, un objet durci, un préimprégné, une plaque stratifiée plaquée de feuille métallique, une feuille composite de résine, une carte de circuit imprimé et un dispositif à semi-conducteurs.
式（ＤＩＰ）で表される化合物由来の構成単位を主成分とし、かつ、式（Ｉｎ－１）および／または式（Ｉｎ－２）で表される構造を有する樹脂。樹脂の製造方法、樹脂を用いた樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置の提供。</description><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>TRANSPORTING</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAMcg329NNRAFMKzv6-Af7BniGe_kAhRz8XhdBgV4UQD9cgV383HgbWtMSc4lReKM3NoOzmGuLsoZtakB-fWlyQmJyal1oSH-5vZGBkYmhgaGRs7mhoTJwqAKgGJQc</recordid><startdate>20240516</startdate><enddate>20240516</enddate><creator>MIYAMOTO Makoto</creator><creator>FUTAMURA Keisuke</creator><scope>EVB</scope></search><sort><creationdate>20240516</creationdate><title>RESIN, RESIN COMPOSITION, AND USE THEREOF</title><author>MIYAMOTO Makoto ; FUTAMURA Keisuke</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2024101237A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; jpn</language><creationdate>2024</creationdate><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>TRANSPORTING</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>MIYAMOTO Makoto</creatorcontrib><creatorcontrib>FUTAMURA Keisuke</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MIYAMOTO Makoto</au><au>FUTAMURA Keisuke</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>RESIN, RESIN COMPOSITION, AND USE THEREOF</title><date>2024-05-16</date><risdate>2024</risdate><abstract>This resin has a structural unit derived from a compound represented by formula (DIP) as a main component thereof, and has a structure represented by formula (In-1) and/or formula (In-2). The present invention also provides a resin production method, a resin composition using said resin, a cured product, a prepreg, a metal foil-clad laminate, a resin composite sheet, a printed wiring board, and a semiconductor device.
L'invention concerne une résine ayant pour principal composant une unité structurale dérivée d'un composé représenté par la formule (DIP), et possédant une structure représentée par la formule （Ｉｎ－１） et/ou la formule （Ｉｎ－２）. En outre, l'invention fournit un procédé de fabrication de cette résine, une composition de résine mettant en œuvre cette résine, un objet durci, un préimprégné, une plaque stratifiée plaquée de feuille métallique, une feuille composite de résine, une carte de circuit imprimé et un dispositif à semi-conducteurs.
式（ＤＩＰ）で表される化合物由来の構成単位を主成分とし、かつ、式（Ｉｎ－１）および／または式（Ｉｎ－２）で表される構造を有する樹脂。樹脂の製造方法、樹脂を用いた樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置の提供。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP |
| title | RESIN, RESIN COMPOSITION, AND USE THEREOF |
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