OUTER PACKAGING MATERIAL FOR VACUUM THERMAL INSULATION MATERIALS, VACUUM THERMAL INSULATION MATERIAL, AND ARTICLE WITH VACUUM THERMAL INSULATION MATERIAL
The present disclosure provides an outer packaging material for vacuum thermal insulation materials, the outer packaging material comprising a film that has a base material which comprises a polyethylene terephthalate and an inorganic layer which is configured from an inorganic material and is dispo...
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creator | MIZOSHIRI, Makoto MUNEDA, Taku |
description | The present disclosure provides an outer packaging material for vacuum thermal insulation materials, the outer packaging material comprising a film that has a base material which comprises a polyethylene terephthalate and an inorganic layer which is configured from an inorganic material and is disposed on at least one surface of the base material, wherein the polyethylene terephthalate base material has a lamellar period of 13.0 nm to 16.0 nm.
La présente invention concerne un matériau d'emballage externe pour matériaux d'isolation thermique sous vide, le matériau d'emballage externe comprenant un film qui présente un matériau de base comprenant un téréphtalate de polyéthylène et une couche inorganique qui est conçue à partir d'un matériau inorganique et est disposée sur au moins une surface du matériau de base, le matériau de base de poly(téréphtalate d'éthylène) ayant une période lamellaire de 13,0 nm à 16,0 nm.
本開示においては、ポリエチレンテレフタレートを有する基材と、上記基材の少なくとも一方の面に配置され、無機物から構成される無機層と、を有するフィルムを有する真空断熱材用外包材であって、上記ポリエチレンテレフタレート基材のラメラ周期が13.0nm以上、16.0nm以下である、真空断熱材用外包材を提供する。 |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_WO2024090166A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>WO2024090166A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_WO2024090166A13</originalsourceid><addsrcrecordid>eNrjZJjpHxriGqQQ4Ojs7eju6eeu4OsI5Hs6-ii4-QcphDk6h4b6KoR4uAb5AoU8_YJDfRxDPP394MqCdYhQpKPg6Oei4BgU4uns46oQ7hniQYQmHgbWtMSc4lReKM3NoOzmGuLsoZtakB-fWlyQmJyal1oSH-5vZGBkYmBpYGhm5mhoTJwqAOfBRE0</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>OUTER PACKAGING MATERIAL FOR VACUUM THERMAL INSULATION MATERIALS, VACUUM THERMAL INSULATION MATERIAL, AND ARTICLE WITH VACUUM THERMAL INSULATION MATERIAL</title><source>esp@cenet</source><creator>MIZOSHIRI, Makoto ; MUNEDA, Taku</creator><creatorcontrib>MIZOSHIRI, Makoto ; MUNEDA, Taku</creatorcontrib><description>The present disclosure provides an outer packaging material for vacuum thermal insulation materials, the outer packaging material comprising a film that has a base material which comprises a polyethylene terephthalate and an inorganic layer which is configured from an inorganic material and is disposed on at least one surface of the base material, wherein the polyethylene terephthalate base material has a lamellar period of 13.0 nm to 16.0 nm.
La présente invention concerne un matériau d'emballage externe pour matériaux d'isolation thermique sous vide, le matériau d'emballage externe comprenant un film qui présente un matériau de base comprenant un téréphtalate de polyéthylène et une couche inorganique qui est conçue à partir d'un matériau inorganique et est disposée sur au moins une surface du matériau de base, le matériau de base de poly(téréphtalate d'éthylène) ayant une période lamellaire de 13,0 nm à 16,0 nm.
本開示においては、ポリエチレンテレフタレートを有する基材と、上記基材の少なくとも一方の面に配置され、無機物から構成される無機層と、を有するフィルムを有する真空断熱材用外包材であって、上記ポリエチレンテレフタレート基材のラメラ周期が13.0nm以上、16.0nm以下である、真空断熱材用外包材を提供する。</description><language>eng ; fre ; jpn</language><subject>BLASTING ; ENGINEERING ELEMENTS AND UNITS ; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS ; HEATING ; JOINTS OR FITTINGS FOR PIPES ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; LIGHTING ; MEANS FOR THERMAL INSULATION IN GENERAL ; MECHANICAL ENGINEERING ; PERFORMING OPERATIONS ; PIPES ; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING ; THERMAL INSULATION IN GENERAL ; TRANSPORTING ; WEAPONS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240502&DB=EPODOC&CC=WO&NR=2024090166A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25551,76304</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240502&DB=EPODOC&CC=WO&NR=2024090166A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MIZOSHIRI, Makoto</creatorcontrib><creatorcontrib>MUNEDA, Taku</creatorcontrib><title>OUTER PACKAGING MATERIAL FOR VACUUM THERMAL INSULATION MATERIALS, VACUUM THERMAL INSULATION MATERIAL, AND ARTICLE WITH VACUUM THERMAL INSULATION MATERIAL</title><description>The present disclosure provides an outer packaging material for vacuum thermal insulation materials, the outer packaging material comprising a film that has a base material which comprises a polyethylene terephthalate and an inorganic layer which is configured from an inorganic material and is disposed on at least one surface of the base material, wherein the polyethylene terephthalate base material has a lamellar period of 13.0 nm to 16.0 nm.
La présente invention concerne un matériau d'emballage externe pour matériaux d'isolation thermique sous vide, le matériau d'emballage externe comprenant un film qui présente un matériau de base comprenant un téréphtalate de polyéthylène et une couche inorganique qui est conçue à partir d'un matériau inorganique et est disposée sur au moins une surface du matériau de base, le matériau de base de poly(téréphtalate d'éthylène) ayant une période lamellaire de 13,0 nm à 16,0 nm.
本開示においては、ポリエチレンテレフタレートを有する基材と、上記基材の少なくとも一方の面に配置され、無機物から構成される無機層と、を有するフィルムを有する真空断熱材用外包材であって、上記ポリエチレンテレフタレート基材のラメラ周期が13.0nm以上、16.0nm以下である、真空断熱材用外包材を提供する。</description><subject>BLASTING</subject><subject>ENGINEERING ELEMENTS AND UNITS</subject><subject>GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS</subject><subject>HEATING</subject><subject>JOINTS OR FITTINGS FOR PIPES</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>LIGHTING</subject><subject>MEANS FOR THERMAL INSULATION IN GENERAL</subject><subject>MECHANICAL ENGINEERING</subject><subject>PERFORMING OPERATIONS</subject><subject>PIPES</subject><subject>SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING</subject><subject>THERMAL INSULATION IN GENERAL</subject><subject>TRANSPORTING</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJjpHxriGqQQ4Ojs7eju6eeu4OsI5Hs6-ii4-QcphDk6h4b6KoR4uAb5AoU8_YJDfRxDPP394MqCdYhQpKPg6Oei4BgU4uns46oQ7hniQYQmHgbWtMSc4lReKM3NoOzmGuLsoZtakB-fWlyQmJyal1oSH-5vZGBkYmBpYGhm5mhoTJwqAOfBRE0</recordid><startdate>20240502</startdate><enddate>20240502</enddate><creator>MIZOSHIRI, Makoto</creator><creator>MUNEDA, Taku</creator><scope>EVB</scope></search><sort><creationdate>20240502</creationdate><title>OUTER PACKAGING MATERIAL FOR VACUUM THERMAL INSULATION MATERIALS, VACUUM THERMAL INSULATION MATERIAL, AND ARTICLE WITH VACUUM THERMAL INSULATION MATERIAL</title><author>MIZOSHIRI, Makoto ; MUNEDA, Taku</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2024090166A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; jpn</language><creationdate>2024</creationdate><topic>BLASTING</topic><topic>ENGINEERING ELEMENTS AND UNITS</topic><topic>GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS</topic><topic>HEATING</topic><topic>JOINTS OR FITTINGS FOR PIPES</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>LIGHTING</topic><topic>MEANS FOR THERMAL INSULATION IN GENERAL</topic><topic>MECHANICAL ENGINEERING</topic><topic>PERFORMING OPERATIONS</topic><topic>PIPES</topic><topic>SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING</topic><topic>THERMAL INSULATION IN GENERAL</topic><topic>TRANSPORTING</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>MIZOSHIRI, Makoto</creatorcontrib><creatorcontrib>MUNEDA, Taku</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MIZOSHIRI, Makoto</au><au>MUNEDA, Taku</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>OUTER PACKAGING MATERIAL FOR VACUUM THERMAL INSULATION MATERIALS, VACUUM THERMAL INSULATION MATERIAL, AND ARTICLE WITH VACUUM THERMAL INSULATION MATERIAL</title><date>2024-05-02</date><risdate>2024</risdate><abstract>The present disclosure provides an outer packaging material for vacuum thermal insulation materials, the outer packaging material comprising a film that has a base material which comprises a polyethylene terephthalate and an inorganic layer which is configured from an inorganic material and is disposed on at least one surface of the base material, wherein the polyethylene terephthalate base material has a lamellar period of 13.0 nm to 16.0 nm.
La présente invention concerne un matériau d'emballage externe pour matériaux d'isolation thermique sous vide, le matériau d'emballage externe comprenant un film qui présente un matériau de base comprenant un téréphtalate de polyéthylène et une couche inorganique qui est conçue à partir d'un matériau inorganique et est disposée sur au moins une surface du matériau de base, le matériau de base de poly(téréphtalate d'éthylène) ayant une période lamellaire de 13,0 nm à 16,0 nm.
本開示においては、ポリエチレンテレフタレートを有する基材と、上記基材の少なくとも一方の面に配置され、無機物から構成される無機層と、を有するフィルムを有する真空断熱材用外包材であって、上記ポリエチレンテレフタレート基材のラメラ周期が13.0nm以上、16.0nm以下である、真空断熱材用外包材を提供する。</abstract><oa>free_for_read</oa></addata></record> |
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language | eng ; fre ; jpn |
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subjects | BLASTING ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS HEATING JOINTS OR FITTINGS FOR PIPES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM LIGHTING MEANS FOR THERMAL INSULATION IN GENERAL MECHANICAL ENGINEERING PERFORMING OPERATIONS PIPES SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING THERMAL INSULATION IN GENERAL TRANSPORTING WEAPONS |
title | OUTER PACKAGING MATERIAL FOR VACUUM THERMAL INSULATION MATERIALS, VACUUM THERMAL INSULATION MATERIAL, AND ARTICLE WITH VACUUM THERMAL INSULATION MATERIAL |
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