CIRCUIT BOARD, AND METHOD FOR MANUFACTURING CIRCUIT BOARD

This circuit board comprises a fluorine resin layer, a to-be-adhered layer, and an adhesive layer adhering the fluorine resin layer with the to-be-adhered layer. The fluorine resin layer includes polytetrafluoroethylene and a first inorganic filler. The content of the first inorganic filler in the f...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SUGIURA Motohiko, KAIMORI Shingo, KIYA Satoshi, IMAZAKI Eiko, UEDA Hiroshi
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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