CONNECTING ELEMENT FOR THERMALLY CONTACTING A COMPONENT TO BE COOLED AND A HEAT SINK
The invention relates to a connecting element (600) for thermally contacting an electrical connecting component (3041) of a power module (110) and a heat sink (206), comprising at least two dielectric layers (601, 603) and a metal layer (602), wherein the metal layer (602) is arranged between the tw...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; fre |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | MORELLE, Jean Michel TAN, Ky-Lim CANITROT, Didier |
| description | The invention relates to a connecting element (600) for thermally contacting an electrical connecting component (3041) of a power module (110) and a heat sink (206), comprising at least two dielectric layers (601, 603) and a metal layer (602), wherein the metal layer (602) is arranged between the two dielectric layers (601, 603) and comprises an aluminium sheet or plate.
L'invention concerne élément de liaison (600) destiné à mettre en contact thermique une pièce de connexion électrique (3041) d'un module de puissance (110) et un dissipateur de chaleur (206) et comprenant au moins deux couches diélectriques (601, 603) et une couche métallique (602), la couche métallique (602) étant disposée entre lesdites deux couches diélectriques (601, 603), ladite couche métallique comprenant une feuille ou une plaque en aluminium. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_WO2024068798A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>WO2024068798A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_WO2024068798A13</originalsourceid><addsrcrecordid>eNrjZAhx9vfzc3UO8fRzV3D1cfV19QtRcPMPUgjxcA3ydfTxiVQAKghxhChwBHJ8A_z9QIpC_BWcXIF8fx9XFwVHPyBW8HB1DFEI9vTz5mFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8eH-RgZGJgZmFuaWFo6GxsSpAgC6kDCb</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>CONNECTING ELEMENT FOR THERMALLY CONTACTING A COMPONENT TO BE COOLED AND A HEAT SINK</title><source>esp@cenet</source><creator>MORELLE, Jean Michel ; TAN, Ky-Lim ; CANITROT, Didier</creator><creatorcontrib>MORELLE, Jean Michel ; TAN, Ky-Lim ; CANITROT, Didier</creatorcontrib><description>The invention relates to a connecting element (600) for thermally contacting an electrical connecting component (3041) of a power module (110) and a heat sink (206), comprising at least two dielectric layers (601, 603) and a metal layer (602), wherein the metal layer (602) is arranged between the two dielectric layers (601, 603) and comprises an aluminium sheet or plate.
L'invention concerne élément de liaison (600) destiné à mettre en contact thermique une pièce de connexion électrique (3041) d'un module de puissance (110) et un dissipateur de chaleur (206) et comprenant au moins deux couches diélectriques (601, 603) et une couche métallique (602), la couche métallique (602) étant disposée entre lesdites deux couches diélectriques (601, 603), ladite couche métallique comprenant une feuille ou une plaque en aluminium.</description><language>eng ; fre</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240404&DB=EPODOC&CC=WO&NR=2024068798A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25551,76302</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240404&DB=EPODOC&CC=WO&NR=2024068798A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MORELLE, Jean Michel</creatorcontrib><creatorcontrib>TAN, Ky-Lim</creatorcontrib><creatorcontrib>CANITROT, Didier</creatorcontrib><title>CONNECTING ELEMENT FOR THERMALLY CONTACTING A COMPONENT TO BE COOLED AND A HEAT SINK</title><description>The invention relates to a connecting element (600) for thermally contacting an electrical connecting component (3041) of a power module (110) and a heat sink (206), comprising at least two dielectric layers (601, 603) and a metal layer (602), wherein the metal layer (602) is arranged between the two dielectric layers (601, 603) and comprises an aluminium sheet or plate.
L'invention concerne élément de liaison (600) destiné à mettre en contact thermique une pièce de connexion électrique (3041) d'un module de puissance (110) et un dissipateur de chaleur (206) et comprenant au moins deux couches diélectriques (601, 603) et une couche métallique (602), la couche métallique (602) étant disposée entre lesdites deux couches diélectriques (601, 603), ladite couche métallique comprenant une feuille ou une plaque en aluminium.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAhx9vfzc3UO8fRzV3D1cfV19QtRcPMPUgjxcA3ydfTxiVQAKghxhChwBHJ8A_z9QIpC_BWcXIF8fx9XFwVHPyBW8HB1DFEI9vTz5mFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8eH-RgZGJgZmFuaWFo6GxsSpAgC6kDCb</recordid><startdate>20240404</startdate><enddate>20240404</enddate><creator>MORELLE, Jean Michel</creator><creator>TAN, Ky-Lim</creator><creator>CANITROT, Didier</creator><scope>EVB</scope></search><sort><creationdate>20240404</creationdate><title>CONNECTING ELEMENT FOR THERMALLY CONTACTING A COMPONENT TO BE COOLED AND A HEAT SINK</title><author>MORELLE, Jean Michel ; TAN, Ky-Lim ; CANITROT, Didier</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2024068798A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>MORELLE, Jean Michel</creatorcontrib><creatorcontrib>TAN, Ky-Lim</creatorcontrib><creatorcontrib>CANITROT, Didier</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MORELLE, Jean Michel</au><au>TAN, Ky-Lim</au><au>CANITROT, Didier</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CONNECTING ELEMENT FOR THERMALLY CONTACTING A COMPONENT TO BE COOLED AND A HEAT SINK</title><date>2024-04-04</date><risdate>2024</risdate><abstract>The invention relates to a connecting element (600) for thermally contacting an electrical connecting component (3041) of a power module (110) and a heat sink (206), comprising at least two dielectric layers (601, 603) and a metal layer (602), wherein the metal layer (602) is arranged between the two dielectric layers (601, 603) and comprises an aluminium sheet or plate.
L'invention concerne élément de liaison (600) destiné à mettre en contact thermique une pièce de connexion électrique (3041) d'un module de puissance (110) et un dissipateur de chaleur (206) et comprenant au moins deux couches diélectriques (601, 603) et une couche métallique (602), la couche métallique (602) étant disposée entre lesdites deux couches diélectriques (601, 603), ladite couche métallique comprenant une feuille ou une plaque en aluminium.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; fre |
| recordid | cdi_epo_espacenet_WO2024068798A1 |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | CONNECTING ELEMENT FOR THERMALLY CONTACTING A COMPONENT TO BE COOLED AND A HEAT SINK |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-15T15%3A07%3A59IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MORELLE,%20Jean%20Michel&rft.date=2024-04-04&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EWO2024068798A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |