ROLLED COPPER FOIL, COPPER-CLAD LAMINATE, METHOD FOR MANUFACTURING COPPER-CLAD LAMINATE, METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING ELECTRONIC PART
Provided is a rolled copper foil having greater flexural properties than conventional flexural properties when passing through CCL manufacturing using a lamination method and being made into FPC. The present invention is a rolled copper foil containing at least 99.9 mass% Cu, the remainder being una...
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| creator | OTA, Akimitsu NAKAGAWA, Kotaro CHO, Shunsuke |
| description | Provided is a rolled copper foil having greater flexural properties than conventional flexural properties when passing through CCL manufacturing using a lamination method and being made into FPC. The present invention is a rolled copper foil containing at least 99.9 mass% Cu, the remainder being unavoidable impurities, and having an arithmetic mean Cube area ratio of at least 77.0% when measuring a total of three points, one arbitrary point and two other points separated equidistantly therefrom such as by 5 mm each in a direction perpendicular to rolling, when heat-treated at a soak temperature of 370°C for a soak time of 1 sec.
L'invention concerne une feuille de cuivre laminée, laquelle présente une flexibilité plus élevée que dans l'art antérieur, lorsqu'elle est transformée en plaque à circuits imprimés souples (FPC) après production d'un stratifié recouvert de cuivre par laminage. Cette feuille de cuivre laminée contient 99,9% en masse de Cu, le reste étant constitué d'inévitables impuretés, et lors d'un traitement thermique à une température de maintien de chauffage à 370℃ et une durée de maintien de chauffage d'une seconde, la valeur moyenne arithmétique du rapport de surface Cube mesurée en 3 points au total, soit en un premier point aléatoire et en deux points chacun espacé de 5mm à partir du premier point et en direction perpendiculaire à la direction de laminage, est supérieure ou égale à 77,0%.
ラミネート法によるＣＣＬ製造を経てＦＰＣ化した際に従来以上の高屈曲性を有する圧延銅箔を提供する。圧延銅箔であって、Ｃｕを９９．９質量％以上含み、残部が不可避的不純物からなり、加熱保持温度３７０℃、加熱保持時間１秒で熱処理したときに任意の１点およびそこから圧延直角方向に５ｍｍずつ等間隔に離れた２点の計３点を測定した、Ｃｕｂｅ面積率の算術平均値が７７．０％以上である。 |
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L'invention concerne une feuille de cuivre laminée, laquelle présente une flexibilité plus élevée que dans l'art antérieur, lorsqu'elle est transformée en plaque à circuits imprimés souples (FPC) après production d'un stratifié recouvert de cuivre par laminage. Cette feuille de cuivre laminée contient 99,9% en masse de Cu, le reste étant constitué d'inévitables impuretés, et lors d'un traitement thermique à une température de maintien de chauffage à 370℃ et une durée de maintien de chauffage d'une seconde, la valeur moyenne arithmétique du rapport de surface Cube mesurée en 3 points au total, soit en un premier point aléatoire et en deux points chacun espacé de 5mm à partir du premier point et en direction perpendiculaire à la direction de laminage, est supérieure ou égale à 77,0%.
ラミネート法によるＣＣＬ製造を経てＦＰＣ化した際に従来以上の高屈曲性を有する圧延銅箔を提供する。圧延銅箔であって、Ｃｕを９９．９質量％以上含み、残部が不可避的不純物からなり、加熱保持温度３７０℃、加熱保持時間１秒で熱処理したときに任意の１点およびそこから圧延直角方向に５ｍｍずつ等間隔に離れた２点の計３点を測定した、Ｃｕｂｅ面積率の算術平均値が７７．０％以上である。</description><language>eng ; fre ; jpn</language><subject>ALLOYS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS ; CHEMISTRY ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FERROUS OR NON-FERROUS ALLOYS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; PRINTED CIRCUITS ; TREATMENT OF ALLOYS OR NON-FERROUS METALS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240118&DB=EPODOC&CC=WO&NR=2024014171A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240118&DB=EPODOC&CC=WO&NR=2024014171A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OTA, Akimitsu</creatorcontrib><creatorcontrib>NAKAGAWA, Kotaro</creatorcontrib><creatorcontrib>CHO, Shunsuke</creatorcontrib><title>ROLLED COPPER FOIL, COPPER-CLAD LAMINATE, METHOD FOR MANUFACTURING COPPER-CLAD LAMINATE, METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING ELECTRONIC PART</title><description>Provided is a rolled copper foil having greater flexural properties than conventional flexural properties when passing through CCL manufacturing using a lamination method and being made into FPC. The present invention is a rolled copper foil containing at least 99.9 mass% Cu, the remainder being unavoidable impurities, and having an arithmetic mean Cube area ratio of at least 77.0% when measuring a total of three points, one arbitrary point and two other points separated equidistantly therefrom such as by 5 mm each in a direction perpendicular to rolling, when heat-treated at a soak temperature of 370°C for a soak time of 1 sec.
L'invention concerne une feuille de cuivre laminée, laquelle présente une flexibilité plus élevée que dans l'art antérieur, lorsqu'elle est transformée en plaque à circuits imprimés souples (FPC) après production d'un stratifié recouvert de cuivre par laminage. Cette feuille de cuivre laminée contient 99,9% en masse de Cu, le reste étant constitué d'inévitables impuretés, et lors d'un traitement thermique à une température de maintien de chauffage à 370℃ et une durée de maintien de chauffage d'une seconde, la valeur moyenne arithmétique du rapport de surface Cube mesurée en 3 points au total, soit en un premier point aléatoire et en deux points chacun espacé de 5mm à partir du premier point et en direction perpendiculaire à la direction de laminage, est supérieure ou égale à 77,0%.
ラミネート法によるＣＣＬ製造を経てＦＰＣ化した際に従来以上の高屈曲性を有する圧延銅箔を提供する。圧延銅箔であって、Ｃｕを９９．９質量％以上含み、残部が不可避的不純物からなり、加熱保持温度３７０℃、加熱保持時間１秒で熱処理したときに任意の１点およびそこから圧延直角方向に５ｍｍずつ等間隔に離れた２点の計３点を測定した、Ｃｕｂｅ面積率の算術平均値が７７．０％以上である。</description><subject>ALLOYS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS</subject><subject>CHEMISTRY</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FERROUS OR NON-FERROUS ALLOYS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>PRINTED CIRCUITS</subject><subject>TREATMENT OF ALLOYS OR NON-FERROUS METALS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqVjbEKwjAURbs4iPoPD1xbaKvg_Jq82ECahPCKbqVInEQL9fv8Nit0FXS6HDiHu0xewRlDEoTzngIop006QyYMSjDYaItMKTTEtZOTEqBB2yoU3AZtj__qytBZV4bAT8ifbx1Eqxkqh0GmgFZ-j8mQ4OCsFuAx8DpZXPvbGDfzrpKtIhZ1FodHF8ehv8R7fHYnV-blPi_2xaHAYveb9QbUj02S</recordid><startdate>20240118</startdate><enddate>20240118</enddate><creator>OTA, Akimitsu</creator><creator>NAKAGAWA, Kotaro</creator><creator>CHO, Shunsuke</creator><scope>EVB</scope></search><sort><creationdate>20240118</creationdate><title>ROLLED COPPER FOIL, COPPER-CLAD LAMINATE, METHOD FOR MANUFACTURING COPPER-CLAD LAMINATE, METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING ELECTRONIC PART</title><author>OTA, Akimitsu ; NAKAGAWA, Kotaro ; CHO, Shunsuke</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2024014171A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; jpn</language><creationdate>2024</creationdate><topic>ALLOYS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS</topic><topic>CHEMISTRY</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FERROUS OR NON-FERROUS ALLOYS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>PRINTED CIRCUITS</topic><topic>TREATMENT OF ALLOYS OR NON-FERROUS METALS</topic><toplevel>online_resources</toplevel><creatorcontrib>OTA, Akimitsu</creatorcontrib><creatorcontrib>NAKAGAWA, Kotaro</creatorcontrib><creatorcontrib>CHO, Shunsuke</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OTA, Akimitsu</au><au>NAKAGAWA, Kotaro</au><au>CHO, Shunsuke</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ROLLED COPPER FOIL, COPPER-CLAD LAMINATE, METHOD FOR MANUFACTURING COPPER-CLAD LAMINATE, METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING ELECTRONIC PART</title><date>2024-01-18</date><risdate>2024</risdate><abstract>Provided is a rolled copper foil having greater flexural properties than conventional flexural properties when passing through CCL manufacturing using a lamination method and being made into FPC. The present invention is a rolled copper foil containing at least 99.9 mass% Cu, the remainder being unavoidable impurities, and having an arithmetic mean Cube area ratio of at least 77.0% when measuring a total of three points, one arbitrary point and two other points separated equidistantly therefrom such as by 5 mm each in a direction perpendicular to rolling, when heat-treated at a soak temperature of 370°C for a soak time of 1 sec.
L'invention concerne une feuille de cuivre laminée, laquelle présente une flexibilité plus élevée que dans l'art antérieur, lorsqu'elle est transformée en plaque à circuits imprimés souples (FPC) après production d'un stratifié recouvert de cuivre par laminage. Cette feuille de cuivre laminée contient 99,9% en masse de Cu, le reste étant constitué d'inévitables impuretés, et lors d'un traitement thermique à une température de maintien de chauffage à 370℃ et une durée de maintien de chauffage d'une seconde, la valeur moyenne arithmétique du rapport de surface Cube mesurée en 3 points au total, soit en un premier point aléatoire et en deux points chacun espacé de 5mm à partir du premier point et en direction perpendiculaire à la direction de laminage, est supérieure ou égale à 77,0%.
ラミネート法によるＣＣＬ製造を経てＦＰＣ化した際に従来以上の高屈曲性を有する圧延銅箔を提供する。圧延銅箔であって、Ｃｕを９９．９質量％以上含み、残部が不可避的不純物からなり、加熱保持温度３７０℃、加熱保持時間１秒で熱処理したときに任意の１点およびそこから圧延直角方向に５ｍｍずつ等間隔に離れた２点の計３点を測定した、Ｃｕｂｅ面積率の算術平均値が７７．０％以上である。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ALLOYS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS TREATMENT OF ALLOYS OR NON-FERROUS METALS |
| title | ROLLED COPPER FOIL, COPPER-CLAD LAMINATE, METHOD FOR MANUFACTURING COPPER-CLAD LAMINATE, METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING ELECTRONIC PART |
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