SYSTEMS AND METHODS FOR CRYOGENIC COOLING
A computing system and related methods are described. The computing system includes a heat-generating component. The computing system includes an evaporation plate thermally connected to the heat-generating component. The computing system includes a cryogenic cooling system positioned proximate to t...
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| creator | CHEUNG, Rick Chun Kit GREGORY, Luke Thomas |
| description | A computing system and related methods are described. The computing system includes a heat-generating component. The computing system includes an evaporation plate thermally connected to the heat-generating component. The computing system includes a cryogenic cooling system positioned proximate to the evaporation plate. The cryogenic cooling system is configured to release a cryogenic fluid onto the evaporation plate to cool the heat-generating component. The cryogenic fluid has a boiling point of less than 273 K.
L'invention concerne un système informatique et des procédés associés. Le système informatique comprend un composant de génération de chaleur. Le système informatique comprend une plaque d'évaporation reliée thermiquement au composant de génération de chaleur. Le système informatique comprend un système de refroidissement cryogénique positionné à proximité de la plaque d'évaporation. Le système de refroidissement cryogénique est configuré pour libérer un fluide cryogénique sur la plaque d'évaporation pour refroidir le composant de génération de chaleur. Le fluide cryogénique a un point d'ébullition inférieur à 273 K. |
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L'invention concerne un système informatique et des procédés associés. Le système informatique comprend un composant de génération de chaleur. Le système informatique comprend une plaque d'évaporation reliée thermiquement au composant de génération de chaleur. Le système informatique comprend un système de refroidissement cryogénique positionné à proximité de la plaque d'évaporation. Le système de refroidissement cryogénique est configuré pour libérer un fluide cryogénique sur la plaque d'évaporation pour refroidir le composant de génération de chaleur. Le fluide cryogénique a un point d'ébullition inférieur à 273 K.</description><language>eng ; fre</language><subject>CALCULATING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; COMPUTING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PHYSICS ; PRINTED CIRCUITS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240104&DB=EPODOC&CC=WO&NR=2024005976A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240104&DB=EPODOC&CC=WO&NR=2024005976A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHEUNG, Rick Chun Kit</creatorcontrib><creatorcontrib>GREGORY, Luke Thomas</creatorcontrib><title>SYSTEMS AND METHODS FOR CRYOGENIC COOLING</title><description>A computing system and related methods are described. The computing system includes a heat-generating component. The computing system includes an evaporation plate thermally connected to the heat-generating component. The computing system includes a cryogenic cooling system positioned proximate to the evaporation plate. The cryogenic cooling system is configured to release a cryogenic fluid onto the evaporation plate to cool the heat-generating component. The cryogenic fluid has a boiling point of less than 273 K.
L'invention concerne un système informatique et des procédés associés. Le système informatique comprend un composant de génération de chaleur. Le système informatique comprend une plaque d'évaporation reliée thermiquement au composant de génération de chaleur. Le système informatique comprend un système de refroidissement cryogénique positionné à proximité de la plaque d'évaporation. Le système de refroidissement cryogénique est configuré pour libérer un fluide cryogénique sur la plaque d'évaporation pour refroidir le composant de génération de chaleur. Le fluide cryogénique a un point d'ébullition inférieur à 273 K.</description><subject>CALCULATING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAMjgwOcfUNVnD0c1HwdQ3x8HcJVnDzD1JwDor0d3f183RWcPb39_H0c-dhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfHh_kYGRiYGBqaW5maOhsbEqQIAxJElWg</recordid><startdate>20240104</startdate><enddate>20240104</enddate><creator>CHEUNG, Rick Chun Kit</creator><creator>GREGORY, Luke Thomas</creator><scope>EVB</scope></search><sort><creationdate>20240104</creationdate><title>SYSTEMS AND METHODS FOR CRYOGENIC COOLING</title><author>CHEUNG, Rick Chun Kit ; GREGORY, Luke Thomas</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2024005976A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2024</creationdate><topic>CALCULATING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>CHEUNG, Rick Chun Kit</creatorcontrib><creatorcontrib>GREGORY, Luke Thomas</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHEUNG, Rick Chun Kit</au><au>GREGORY, Luke Thomas</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SYSTEMS AND METHODS FOR CRYOGENIC COOLING</title><date>2024-01-04</date><risdate>2024</risdate><abstract>A computing system and related methods are described. The computing system includes a heat-generating component. The computing system includes an evaporation plate thermally connected to the heat-generating component. The computing system includes a cryogenic cooling system positioned proximate to the evaporation plate. The cryogenic cooling system is configured to release a cryogenic fluid onto the evaporation plate to cool the heat-generating component. The cryogenic fluid has a boiling point of less than 273 K.
L'invention concerne un système informatique et des procédés associés. Le système informatique comprend un composant de génération de chaleur. Le système informatique comprend une plaque d'évaporation reliée thermiquement au composant de génération de chaleur. Le système informatique comprend un système de refroidissement cryogénique positionné à proximité de la plaque d'évaporation. Le système de refroidissement cryogénique est configuré pour libérer un fluide cryogénique sur la plaque d'évaporation pour refroidir le composant de génération de chaleur. Le fluide cryogénique a un point d'ébullition inférieur à 273 K.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS |
| title | SYSTEMS AND METHODS FOR CRYOGENIC COOLING |
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