EPOXY MODIFIED RESIN

The present disclosure relates a modified epoxy resin and a process for making the modified epoxy resin. The modified epoxy resin includes an aromatic group having at least one free hydroxy group. The modified epoxy resin demonstrates low temperature or room temperature fast curing along with better...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KENDHALE, Amol Murlidharrao, PAYMALLE, Shashikant Sangmeshwar
Format: Patent
Sprache:eng ; fre
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