CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE

CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE

Embodiments of the present application provide a circuit board assembly and an electronic device. The circuit board assembly at least comprises: a lower-layer board and an upper-layer board, an outer frame and at least one intermediate being integrally formed on one of the lower-layer board and the...

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Hauptverfasser: SHI, Hongbin, ZOU, Mengruo, LIU, Daode
Format: Patent
Sprache:chi ; eng ; fre
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator SHI, Hongbin
ZOU, Mengruo
LIU, Daode
description Embodiments of the present application provide a circuit board assembly and an electronic device. The circuit board assembly at least comprises: a lower-layer board and an upper-layer board, an outer frame and at least one intermediate being integrally formed on one of the lower-layer board and the upper-layer board, and the outer frame and the intermediate being located between the lower-layer board and the upper-layer board. An end surface of one end of the outer frame at least has a first step surface and a second step surface, the upper-layer board or the lower-layer board is located on the first step surface and the second step surface, and the first step surface and the second step surface have different heights in the thickness direction of the circuit board assembly. The intermediate divides a cavity defined by the upper-layer board, the lower-layer board, and the outer frame into at least two accommodating cavities having different heights and spaced apart from each other, and a component is disposed
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE
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