HEAT DISSIPATION DEVICE, CIRCUIT BOARD, AND COMMUNICATION BASE STATION

Provided in the present application are a heat dissipation device, a circuit board, and a communication base station. The heat dissipation device comprises a substrate (100), a first heat dissipation fin (200) and a second heat dissipation fin (300), wherein the first heat dissipation fin (200) and...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ZHOU, Ailan, GUO, Tiansheng, LI, Dechao, GUO, Hongtao, WANG, Yu
Format:	Patent
Sprache:	chi ; eng ; fre
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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