ADHESIVE COMPOSITION, CIRCUIT CONNECTION MATERIAL, AND CONNECTION BODY

This adhesive composition contains a thermoplastic resin (a), a radical-polymerizable compound (b), and a radical polymerization initiator (c). A polyurethane resin (a-1) and a phenoxy resin (a-2) are contained as the thermoplastic resin (a). A radical-polymerizable compound (b-1) having a structure...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	KUDO Sunao, AKIYAMA Yuya
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY CONDUCTORS DYES ELECTRICITY INSULATORS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES USE OF MATERIALS AS ADHESIVES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!