PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR, AND POWER MODULE

Provided is a printed circuit board comprising a ceramic plate, a metal plate, and a brazing layer joining the ceramic plate and the metal plate, wherein recesses are formed in the main surface of the metal plate that joins the ceramic plate, and the recesses are provided further inside than the out...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YUASA Akimasa, NAKAMURA Takahiro, KOBASHI Seiji, IKARASHI Koki, ESHIMA Yoshiyuki, HAMAOKA Tomohiro
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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