PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR, AND POWER MODULE
Provided is a printed circuit board comprising a ceramic plate, a metal plate, and a brazing layer joining the ceramic plate and the metal plate, wherein recesses are formed in the main surface of the metal plate that joins the ceramic plate, and the recesses are provided further inside than the out...
Gespeichert in:
| Hauptverfasser: | , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; fre ; jpn |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | YUASA Akimasa NAKAMURA Takahiro KOBASHI Seiji IKARASHI Koki ESHIMA Yoshiyuki HAMAOKA Tomohiro |
| description | Provided is a printed circuit board comprising a ceramic plate, a metal plate, and a brazing layer joining the ceramic plate and the metal plate, wherein recesses are formed in the main surface of the metal plate that joins the ceramic plate, and the recesses are provided further inside than the outer edge of the main surface. Also provided is a power module comprising the printed circuit board and semiconductor elements electrically connected to the metal plate of the printed circuit board.
L'invention concerne une carte de circuit imprimé comprenant une plaque céramique, une plaque métallique et une couche de brasage reliant la plaque céramique et la plaque métallique, des évidements étant formés dans la surface principale de la plaque métallique qui relie la plaque céramique, et les évidements étant formés davantage à l'intérieur par rapport au bord externe de la surface principale. L'invention concerne également un module de puissance comprenant la carte de circuit imprimé et des éléments semi-conducteurs connectés électriquement à la plaque métallique de la carte de circuit imprimé.
セラミック板と、金属板と、セラミック板と金属板とを接合するろう材層と、を備える回路基板であって、金属板のセラミック板と接合される主面に凹部が形成されており、凹部は主面の外縁よりも内側に設けられている、回路基板を提供する。回路基板と、当該回路基板の金属板に電気的に接続される半導体素子と、を備えるパワーモジュールを提供する。 |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_WO2023190253A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>WO2023190253A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_WO2023190253A13</originalsourceid><addsrcrecordid>eNrjZPAMCPL0C3F1UXD2DHIO9QxRcPJ3DHJRcPRzUfB19At1c3QOCQWqcFfwdQ3x8HdRCPFwDXJ18w_SASsJ8A93DVLw9XcJ9XHlYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx4f5GBkbGhpYGRqbGjobGxKkCANfDLeA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR, AND POWER MODULE</title><source>esp@cenet</source><creator>YUASA Akimasa ; NAKAMURA Takahiro ; KOBASHI Seiji ; IKARASHI Koki ; ESHIMA Yoshiyuki ; HAMAOKA Tomohiro</creator><creatorcontrib>YUASA Akimasa ; NAKAMURA Takahiro ; KOBASHI Seiji ; IKARASHI Koki ; ESHIMA Yoshiyuki ; HAMAOKA Tomohiro</creatorcontrib><description>Provided is a printed circuit board comprising a ceramic plate, a metal plate, and a brazing layer joining the ceramic plate and the metal plate, wherein recesses are formed in the main surface of the metal plate that joins the ceramic plate, and the recesses are provided further inside than the outer edge of the main surface. Also provided is a power module comprising the printed circuit board and semiconductor elements electrically connected to the metal plate of the printed circuit board.
L'invention concerne une carte de circuit imprimé comprenant une plaque céramique, une plaque métallique et une couche de brasage reliant la plaque céramique et la plaque métallique, des évidements étant formés dans la surface principale de la plaque métallique qui relie la plaque céramique, et les évidements étant formés davantage à l'intérieur par rapport au bord externe de la surface principale. L'invention concerne également un module de puissance comprenant la carte de circuit imprimé et des éléments semi-conducteurs connectés électriquement à la plaque métallique de la carte de circuit imprimé.
セラミック板と、金属板と、セラミック板と金属板とを接合するろう材層と、を備える回路基板であって、金属板のセラミック板と接合される主面に凹部が形成されており、凹部は主面の外縁よりも内側に設けられている、回路基板を提供する。回路基板と、当該回路基板の金属板に電気的に接続される半導体素子と、を備えるパワーモジュールを提供する。</description><language>eng ; fre ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231005&DB=EPODOC&CC=WO&NR=2023190253A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231005&DB=EPODOC&CC=WO&NR=2023190253A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YUASA Akimasa</creatorcontrib><creatorcontrib>NAKAMURA Takahiro</creatorcontrib><creatorcontrib>KOBASHI Seiji</creatorcontrib><creatorcontrib>IKARASHI Koki</creatorcontrib><creatorcontrib>ESHIMA Yoshiyuki</creatorcontrib><creatorcontrib>HAMAOKA Tomohiro</creatorcontrib><title>PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR, AND POWER MODULE</title><description>Provided is a printed circuit board comprising a ceramic plate, a metal plate, and a brazing layer joining the ceramic plate and the metal plate, wherein recesses are formed in the main surface of the metal plate that joins the ceramic plate, and the recesses are provided further inside than the outer edge of the main surface. Also provided is a power module comprising the printed circuit board and semiconductor elements electrically connected to the metal plate of the printed circuit board.
L'invention concerne une carte de circuit imprimé comprenant une plaque céramique, une plaque métallique et une couche de brasage reliant la plaque céramique et la plaque métallique, des évidements étant formés dans la surface principale de la plaque métallique qui relie la plaque céramique, et les évidements étant formés davantage à l'intérieur par rapport au bord externe de la surface principale. L'invention concerne également un module de puissance comprenant la carte de circuit imprimé et des éléments semi-conducteurs connectés électriquement à la plaque métallique de la carte de circuit imprimé.
セラミック板と、金属板と、セラミック板と金属板とを接合するろう材層と、を備える回路基板であって、金属板のセラミック板と接合される主面に凹部が形成されており、凹部は主面の外縁よりも内側に設けられている、回路基板を提供する。回路基板と、当該回路基板の金属板に電気的に接続される半導体素子と、を備えるパワーモジュールを提供する。</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPAMCPL0C3F1UXD2DHIO9QxRcPJ3DHJRcPRzUfB19At1c3QOCQWqcFfwdQ3x8HdRCPFwDXJ18w_SASsJ8A93DVLw9XcJ9XHlYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx4f5GBkbGhpYGRqbGjobGxKkCANfDLeA</recordid><startdate>20231005</startdate><enddate>20231005</enddate><creator>YUASA Akimasa</creator><creator>NAKAMURA Takahiro</creator><creator>KOBASHI Seiji</creator><creator>IKARASHI Koki</creator><creator>ESHIMA Yoshiyuki</creator><creator>HAMAOKA Tomohiro</creator><scope>EVB</scope></search><sort><creationdate>20231005</creationdate><title>PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR, AND POWER MODULE</title><author>YUASA Akimasa ; NAKAMURA Takahiro ; KOBASHI Seiji ; IKARASHI Koki ; ESHIMA Yoshiyuki ; HAMAOKA Tomohiro</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2023190253A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; jpn</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>YUASA Akimasa</creatorcontrib><creatorcontrib>NAKAMURA Takahiro</creatorcontrib><creatorcontrib>KOBASHI Seiji</creatorcontrib><creatorcontrib>IKARASHI Koki</creatorcontrib><creatorcontrib>ESHIMA Yoshiyuki</creatorcontrib><creatorcontrib>HAMAOKA Tomohiro</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YUASA Akimasa</au><au>NAKAMURA Takahiro</au><au>KOBASHI Seiji</au><au>IKARASHI Koki</au><au>ESHIMA Yoshiyuki</au><au>HAMAOKA Tomohiro</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR, AND POWER MODULE</title><date>2023-10-05</date><risdate>2023</risdate><abstract>Provided is a printed circuit board comprising a ceramic plate, a metal plate, and a brazing layer joining the ceramic plate and the metal plate, wherein recesses are formed in the main surface of the metal plate that joins the ceramic plate, and the recesses are provided further inside than the outer edge of the main surface. Also provided is a power module comprising the printed circuit board and semiconductor elements electrically connected to the metal plate of the printed circuit board.
L'invention concerne une carte de circuit imprimé comprenant une plaque céramique, une plaque métallique et une couche de brasage reliant la plaque céramique et la plaque métallique, des évidements étant formés dans la surface principale de la plaque métallique qui relie la plaque céramique, et les évidements étant formés davantage à l'intérieur par rapport au bord externe de la surface principale. L'invention concerne également un module de puissance comprenant la carte de circuit imprimé et des éléments semi-conducteurs connectés électriquement à la plaque métallique de la carte de circuit imprimé.
セラミック板と、金属板と、セラミック板と金属板とを接合するろう材層と、を備える回路基板であって、金属板のセラミック板と接合される主面に凹部が形成されており、凹部は主面の外縁よりも内側に設けられている、回路基板を提供する。回路基板と、当該回路基板の金属板に電気的に接続される半導体素子と、を備えるパワーモジュールを提供する。</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; fre ; jpn |
| recordid | cdi_epo_espacenet_WO2023190253A1 |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR, AND POWER MODULE |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-11T16%3A42%3A15IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=YUASA%20Akimasa&rft.date=2023-10-05&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EWO2023190253A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |