ENDPOINT DETECTION IN LOW OPEN AREA AND/OR HIGH ASPECT RATIO ETCH APPLICATIONS

ENDPOINT DETECTION IN LOW OPEN AREA AND/OR HIGH ASPECT RATIO ETCH APPLICATIONS

Disclosed herein is a method for determining the endpoint of an etch operation used for forming high aspect ratio features and/or over low open area (

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Bibliographische Detailangaben
Hauptverfasser: KOSEKI, Shinichi, WANG, Zefang, WALKER, Quentin, LIAN, Lei
Format: Patent
Sprache:eng ; fre
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Disclosed herein is a method for determining the endpoint of an etch operation used for forming high aspect ratio features and/or over low open area (