HEAT DISSIPATING SYSTEM FOR ELECTRONIC DEVICES

An integrated device package is disclosed. The integrated device package can include a carrier, and a cap bonded to the carrier. The carrier and the cap at least partially define a cavity that is configured to receive a coolant. The integrated device package can include an inorganic material layer d...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HABA, Belgacem, SHEN, Hong, KATKAR, Rajesh, VARIOT, Patrick
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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